Abstract: In this paper family of multilevel inverter topology
with reduced number of power switches is presented. The proposed
inverter can generate both even and odd level. The proposed topology
is suitable for symmetric structure. The proposed symmetric inverter
results in reduction of power switches, power diode and gate driver
circuits and also it may further minimize the installation area and
cost. To prove the superiority of proposed topology is compared with
conventional topologies. The performance of this symmetric
multilevel inverter has been tested by computer based simulation and
prototype based experimental setup for nine-level inverter is
developed and results are verified.
Abstract: One of the major power quality concerns in modern times is the problem of current harmonics. The current harmonics is caused due to the increase in non-linear loads which is largely dominated by power electronics devices. The Shunt active filtering is one of the best solutions for mitigating current harmonics. This paper describes a fuzzy logic controller based (FLC) based three Phase Shunt active Filter to achieve low current harmonic distortion (THD) and Reactive power compensation. The performance of fuzzy logic controller is analysed under both balanced sinusoidal and unbalanced sinusoidal source condition. The above controller serves the purpose of maintaining DC Capacitor Voltage constant. The proposed shunt active filter uses hysteresis current controller for current control of IGBT based PWM inverter. The simulation results of model in Simulink MATLAB reveals satisfying results.
Abstract: Standard packaging and interconnection technologies
of power devices have difficulties meeting the increasing thermal
demands of new application fields of power electronics devices.
Main restrictions are the decreasing reliability of bond-wires and
solder layers with increasing junction temperature. In the last few
years intensive efforts have been invested in developing new
packaging and interconnection solutions which may open a path to
future application of power devices. In this paper, the main failure
mechanisms of power devices are described and principle of new
packaging and interconnection concepts and their power cycling
reliability are presented.