Abstract: Standard packaging and interconnection technologies
of power devices have difficulties meeting the increasing thermal
demands of new application fields of power electronics devices.
Main restrictions are the decreasing reliability of bond-wires and
solder layers with increasing junction temperature. In the last few
years intensive efforts have been invested in developing new
packaging and interconnection solutions which may open a path to
future application of power devices. In this paper, the main failure
mechanisms of power devices are described and principle of new
packaging and interconnection concepts and their power cycling
reliability are presented.