Abstract: The present research reports the investigation of fast etching of silicon for the fabrication of microelectromechanical systems (MEMS) structures using silicon wet bulk micromachining. Low concentration tetramethyl-ammonium hydroxide (TMAH) and hydroxylamine (NH2OH) are used as main etchant and additive, respectively. The concentration of NH2OH is varied to optimize the composition to achieve best etching characteristics such as high etch rate, significantly high undercutting at convex corner for the fast release of the microstructures from the substrate, and improved etched surface morphology. These etching characteristics are studied on Si{100} and Si{110} wafers as they are most widely used in the fabrication of MEMS structures as wells diode, transistors and integrated circuits.
Abstract: This paper details few mechanical modeling and
design issues of RF MEMS switches. We concentrate on an
electrostatically actuated broad side series switch; surface
micromachined with a crab leg membrane. The same results are
extended to any complex structure. With available experimental data
and fabrication results, we present the variation in dynamic
performance and compliance of the switch with reference to few
design issues, which we find are critical in deciding the dynamic
behavior of the switch, without compromise on the RF
characteristics. The optimization of pull in voltage, transient time and
resonant frequency with regard to these critical design parameters are
also presented.