Abstract: Quaternary InxAlyGa1-x-yN semiconductors have
attracted much research interest because the use of this quaternary
offer the great flexibility in tailoring their band gap profile while
maintaining their lattice-matching and structural integrity. The
structural and optical properties of InxAlyGa1-x-yN alloys grown by
molecular beam epitaxy (MBE) is presented. The structural quality of
InxAlyGa1-x-yN layers was characterized using high-resolution X-ray
diffraction (HRXRD). The results confirm that the InxAlyGa1-x-yN
films had wurtzite structure and without phase separation. As the In
composition increases, the Bragg angle of the (0002) InxAlyGa1-x-yN
peak gradually decreases, indicating the increase in the lattice constant
c of the alloys. FWHM of (0002) InxAlyGa1-x-yN decreases with
increasing In composition from 0 to 0.04, that could indicate the
decrease of quality of the samples due to point defects leading to
non-uniformity of the epilayers. UV-VIS spectroscopy have been used
to study the energy band gap of InxAlyGa1-x-yN. As the indium (In)
compositions increases, the energy band gap decreases. However, for
InxAlyGa1-x-yN with In composition of 0.1, the band gap shows a
sudden increase in energy. This is probably due to local alloy
compositional fluctuations in the epilayer. The bowing parameter
which appears also to be very sensitive on In content is investigated
and obtained b = 50.08 for quaternary InxAlyGa1-x-yN alloys. From
photoluminescence (PL) measurement, green luminescence (GL)
appears at PL spectrum of InxAlyGa1-x-yN, emitted for all x at ~530 nm
and it become more pronounced as the In composition (x) increased,
which is believed cause by gallium vacancies and related to isolated
native defects.
Abstract: In recent years image watermarking has become an
important research area in data security, confidentiality and image
integrity. Many watermarking techniques were proposed for medical
images. However, medical images, unlike most of images, require
extreme care when embedding additional data within them because
the additional information must not affect the image quality and
readability. Also the medical records, electronic or not, are linked to
the medical secrecy, for that reason, the records must be confidential.
To fulfill those requirements, this paper presents a lossless
watermarking scheme for DICOM images. The proposed a fragile
scheme combines two reversible techniques based on difference
expansion for patient's data hiding and protecting the region of
interest (ROI) with tamper detection and recovery capability.
Patient's data are embedded into ROI, while recovery data are
embedded into region of non-interest (RONI). The experimental
results show that the original image can be exactly extracted from the
watermarked one in case of no tampering. In case of tampered ROI,
tampered area can be localized and recovered with a high quality
version of the original area.
Abstract: Increasing energy absorption is a significant parameter
in vehicle design. Absorbing more energy results in decreasing
occupant damage. Limitation of the deflection in a side impact results
in decreased energy absorption (SEA) and increased peak load (PL).
Hence a high crash force jeopardizes passenger safety and vehicle
integrity. The aims of this paper are to determine suitable dimensions
and material of a square beam subjected to side impact, in order to
maximize SEA and minimize PL. To achieve this novel goal, the
geometric parameters of a square beam are optimized using the
response surface method (RSM).multi-objective optimization is
performed, and the optimum design for different response features is
obtained.
Abstract: Aluminum alloy has an extensive range of industrial application due to its consistent mechanical properties and structural integrity. The heat treatment by precipitation technique affected the Magnesium, Silicon Manganese and copper crystals dissolved in the Aluminum alloy. The crystals dislocated to precipitate on the crystal’s boundaries of the Aluminum alloy when given a thermal energy increased its hardness. In this project various times and temperature were varied to find out the best combination of these variables to increase the precipitation of the metals on the Aluminum crystal’s boundaries which will lead to get the highest hardness. These specimens are then tested for their hardness and tensile strength. It is noticed that when the temperature increases, the precipitation increases and consequently the hardness increases. A threshold temperature value (264C0) of Aluminum alloy should not be reached due to the occurrence of recrystalization which causes the crystal to grow. This recrystalization process affected the ductility of the alloy and decrease hardness. In addition, and while increasing the temperature the alloy’s mechanical properties will decrease. The mechanical properties, namely tensile and hardness properties are investigated according to standard procedures. In this research, different temperature and time have been applied to increase hardening.The highest hardness at 100°c in 6 hours equals to 207.31 HBR, while at the same temperature and time the lowest elongation equals to 146.5.
Abstract: Significant changes in oil and gas drilling have
emphasized the need to verify the integrity and reliability of drill
stem components. Defects are inevitable in cast components,
regardless of application; but if these defects go undetected, any
severe defect could cause down-hole failure.
One such defect is shrinkage porosity. Castings with lower level
shrinkage porosity (CB levels 1 and 2) have scattered pores and do
not occupy large volumes; so pressure testing and helium leak testing
(HLT) are sufficient for qualifying the castings. However, castings
with shrinkage porosity of CB level 3 and higher, behave erratically
under pressure testing and HLT making these techniques insufficient
for evaluating the castings- integrity.
This paper presents a case study to highlight how the radiography
technique is much more effective than pressure testing and HLT.
Abstract: In a state-of-the-art industrial production line of
photovoltaic products the handling and automation processes are of
particular importance and implication. While processing a fully
functional crystalline solar cell an as-cut photovoltaic wafer is subject
to numerous repeated handling steps. With respect to stronger
requirements in productivity and decreasing rejections due to defects
the mechanical stress on the thin wafers has to be reduced to a
minimum as the fragility increases by decreasing wafer thicknesses.
In relation to the increasing wafer fragility, researches at the
Fraunhofer Institutes IPA and CSP showed a negative correlation
between multiple handling processes and the wafer integrity. Recent
work therefore focused on the analysis and optimization of the dry
wafer stack separation process with compressed air. The achievement
of a wafer sensitive process capability and a high production
throughput rate is the basic motivation in this research.
Abstract: A common way to elude the signature-based Network Intrusion Detection System is based upon changing a recognizable attack to an unrecognizable one via the IDS. For example, in order to evade sign accommodation with intrusion detection system markers, a hacker spilt the payload packet into many small pieces or hides them within messages. In this paper we try to model the main fragmentation attack and create a new module in the intrusion detection architecture system which recognizes the main fragmentation attacks through verification of integrity checking of TCP packet in order to prevent elusion of the system and also to announce the necessary alert to the system administrator.
Abstract: Fast delay estimation methods, as opposed to
simulation techniques, are needed for incremental performance
driven layout synthesis. On-chip inductive effects are becoming
predominant in deep submicron interconnects due to increasing clock
speed and circuit complexity. Inductance causes noise in signal
waveforms, which can adversely affect the performance of the circuit
and signal integrity. Several approaches have been put forward which
consider the inductance for on-chip interconnect modelling. But for
even much higher frequency, of the order of few GHz, the shunt
dielectric lossy component has become comparable to that of other
electrical parameters for high speed VLSI design. In order to cope up
with this effect, on-chip interconnect has to be modelled as
distributed RLCG line. Elmore delay based methods, although
efficient, cannot accurately estimate the delay for RLCG interconnect
line. In this paper, an accurate analytical delay model has been
derived, based on first and second moments of RLCG
interconnection lines. The proposed model considers both the effect
of inductance and conductance matrices. We have performed the
simulation in 0.18μm technology node and an error of as low as less
as 5% has been achieved with the proposed model when compared to
SPICE. The importance of the conductance matrices in interconnect
modelling has also been discussed and it is shown that if G is
neglected for interconnect line modelling, then it will result an delay
error of as high as 6% when compared to SPICE.