Abstract: The high temperature degree and uniform
Temperature Distribution (TD) on surface of cookware which contact
with food are effective factors for improving cookware application.
Additionally, the ability of pan material in retaining the heat and nonreactivity
with foods are other significant properties. It is difficult for
single material to meet a wide variety of demands such as superior
thermal and chemical properties. Multi-Layer Plate (MLP) makes
more regular TD. In this study the main objectives are to find the best
structure (single or multi-layer) and materials to provide maximum
temperature degree and uniform TD up side surface of pan. And also
heat retaining of used metals with goal of improving the thermal
quality of pan to economize the energy. To achieve this aim were
employed Finite Element Method (FEM) for analyzing transient
thermal behavior of applied materials. The analysis has been
extended for different metals, we achieved the best temperature
profile and heat retaining in Copper/ Stainless Steel MLP.