Abstract: Meeting the growth in demand for digital services
such as social media, telecommunications, and business and cloud
services requires large scale data centres, which has led to an increase
in their end use energy demand. Generally, over 30% of data centre
power is consumed by the necessary cooling overhead. Thus energy
can be reduced by improving the cooling efficiency. Air and liquid
can both be used as cooling media for the data centre. Traditional
data centre cooling systems use air, however liquid is recognised as a
promising method that can handle the more densely packed data
centres. Liquid cooling can be classified into three methods; rack heat
exchanger, on-chip heat exchanger and full immersion of the
microelectronics. This study quantifies the improvements of heat
transfer specifically for the case of immersed microelectronics by
varying the CPU and heat sink location. Immersion of the server is
achieved by filling the gap between the microelectronics and a water
jacket with a dielectric liquid which convects the heat from the CPU
to the water jacket on the opposite side. Heat transfer is governed by
two physical mechanisms, which is natural convection for the fixed
enclosure filled with dielectric liquid and forced convection for the
water that is pumped through the water jacket. The model in this
study is validated with published numerical and experimental work
and shows good agreement with previous work. The results show that
the heat transfer performance and Nusselt number (Nu) is improved
by 89% by placing the CPU and heat sink on the bottom of the
microelectronics enclosure.
Abstract: In this paper, numerical simulation is used to
investigate the thermal performance of liquid cooling heatsink with
microchannels due to geometric arrangement. Commercial software
ICEPAK is utilized for the analysis. The considered parameters
include aspect ratio, porosity and the length and height of
microchannel. The aspect ratio varies from 3 to 16 and the length of
microchannel is 10mm, 14mm, and 18mm. The height of
microchannel is 2mm, 3mm and 4mm. It is found short channel have
better thermal efficiency than long channel at 490Pa. No matter the
length of channel the best aspect ratio is 4. It is also noted that pressure
difference at 2940Pa the best aspect ratio from 4 to 8, it means pressure
difference affect aspect ratio, effective thermal resistance at low
pressure difference but lower effective thermal resistance at high
pressure difference.