Multi-Robotic Partial Disassembly Line Balancing with Robotic Efficiency Difference via HNSGA-II

To accelerate the remanufacturing process of electronic waste products, this study designs a partial disassembly line with the multi-robotic station to effectively dispose of excessive wastes. The multi-robotic partial disassembly line is a technical upgrade to the existing manual disassembly line. Balancing optimization can make the disassembly line smoother and more efficient. For partial disassembly line balancing with the multi-robotic station (PDLBMRS), a mixed-integer programming model (MIPM) considering the robotic efficiency differences is established to minimize cycle time, energy consumption and hazard index and to calculate their optimal global values. Besides, an enhanced NSGA-II algorithm (HNSGA-II) is proposed to optimize PDLBMRS efficiently. Finally, MIPM and HNSGA-II are applied to an actual mixed disassembly case of two types of computers, the comparison of the results solved by GUROBI and HNSGA-II verifies the correctness of the model and excellent performance of the algorithm, and the obtained Pareto solution set provides multiple options for decision-makers.

Strategies for E-Waste Management: A Literature Review

During the last few decades, with the high-speed upgrade of electronic products, electronic waste (e-waste) has become one of the fastest growing wastes of the waste stream. In this context, more efforts and concerns have already been placed on the treatment and management of this waste. To mitigate their negative influences on the environment and society, it is necessary to establish appropriate strategies for e-waste management. Hence, this paper aims to review and analysis some useful strategies which have been applied in several countries to handle e-waste. Future perspectives on e-waste management are also suggested. The key findings found that, to manage e-waste successfully, it is necessary to establish effective reverse supply chains for e-waste, and raise public awareness towards the detrimental impacts of e-waste. The result of the research provides valuable insights to governments, policymakers in establishing e-waste management in a safe and sustainable manner.

An Overview of Electronic Waste as Aggregate in Concrete

Rapid growth of world population and widespread urbanization has remarkably increased the development of the construction industry which caused a huge demand for sand and gravels. Environmental problems occur when the rate of extraction of sand, gravels, and other materials exceeds the rate of generation of natural resources; therefore, an alternative source is essential to replace the materials used in concrete. Now-a-days, electronic products have become an integral part of daily life which provides more comfort, security, and ease of exchange of information. These electronic waste (E-Waste) materials have serious human health concerns and require extreme care in its disposal to avoid any adverse impacts. Disposal or dumping of these E-Wastes also causes major issues because it is highly complex to handle and often contains highly toxic chemicals such as lead, cadmium, mercury, beryllium, brominates flame retardants (BFRs), polyvinyl chloride (PVC), and phosphorus compounds. Hence, E-Waste can be incorporated in concrete to make a sustainable environment. This paper deals with the composition, preparation, properties, classification of E-Waste. All these processes avoid dumping to landfills whilst conserving natural aggregate resources, and providing a better environmental option. This paper also provides a detailed literature review on the behaviour of concrete with incorporation of E-Wastes. Many research shows the strong possibility of using E-Waste as a substitute of aggregates eventually it reduces the use of natural aggregates in concrete.

Recovery of Metals from Electronic Waste by Physical and Chemical Recycling Processes

The main purpose of this article is to provide a comprehensive review of various physical and chemical processes for electronic waste (e-waste) recycling, their advantages and shortfalls towards achieving a cleaner process of waste utilization, with especial attention towards extraction of metallic values. Current status and future perspectives of waste printed circuit boards (PCBs) recycling are described. E-waste characterization, dismantling/ disassembly methods, liberation and classification processes, composition determination techniques are covered. Manual selective dismantling and metal-nonmetal liberation at – 150 µm at two step crushing are found to be the best. After size reduction, mainly physical separation/concentration processes employing gravity, electrostatic, magnetic separators, froth floatation etc., which are commonly used in mineral processing, have been critically reviewed here for separation of metals and non-metals, along with useful utilizations of the non-metallic materials. The recovery of metals from e-waste material after physical separation through pyrometallurgical, hydrometallurgical or biohydrometallurgical routes is also discussed along with purification and refining and some suitable flowsheets are also given. It seems that hydrometallurgical route will be a key player in the base and precious metals recoveries from e-waste. E-waste recycling will be a very important sector in the near future from economic and environmental perspectives.

Pre-Analysis of Printed Circuit Boards Based On Multispectral Imaging for Vision Based Recognition of Electronics Waste

The increasing demand of gallium, indium and rare-earth elements for the production of electronics, e.g. solid state-lighting, photovoltaics, integrated circuits, and liquid crystal displays, will exceed the world-wide supply according to current forecasts. Recycling systems to reclaim these materials are not yet in place, which challenges the sustainability of these technologies. This paper proposes a multispectral imaging system as a basis for a vision based recognition system for valuable components of electronics waste. Multispectral images intend to enhance the contrast of images of printed circuit boards (single components, as well as labels) for further analysis, such as optical character recognition and entire printed circuit board recognition. The results show, that a higher contrast is achieved in the near infrared compared to ultraviolett and visible light.