Case Studies of CSAMT Method Applied to Study of Complex Rock Mass Structure and Hidden Tectonic

In projects like waterpower, transportation and mining, etc., proving up the rock-mass structure and hidden tectonic to estimate the geological body-s activity is very important. Integrating the seismic results, drilling and trenching data, CSAMT method was carried out at a planning dame site in southwest China to evaluate the stability of a deformation. 2D and imitated 3D inversion resistivity results of CSAMT method were analyzed. The results indicated that CSAMT was an effective method for defining an outline of deformation body to several hundred meters deep; the Lung Pan Deformation was stable in natural conditions; but uncertain after the future reservoir was impounded. This research presents a good case study of the fine surveying and research on complex geological structure and hidden tectonic in engineering project.

Closed form Delay Model for on-Chip VLSIRLCG Interconnects for Ramp Input for Different Damping Conditions

Fast delay estimation methods, as opposed to simulation techniques, are needed for incremental performance driven layout synthesis. On-chip inductive effects are becoming predominant in deep submicron interconnects due to increasing clock speed and circuit complexity. Inductance causes noise in signal waveforms, which can adversely affect the performance of the circuit and signal integrity. Several approaches have been put forward which consider the inductance for on-chip interconnect modelling. But for even much higher frequency, of the order of few GHz, the shunt dielectric lossy component has become comparable to that of other electrical parameters for high speed VLSI design. In order to cope up with this effect, on-chip interconnect has to be modelled as distributed RLCG line. Elmore delay based methods, although efficient, cannot accurately estimate the delay for RLCG interconnect line. In this paper, an accurate analytical delay model has been derived, based on first and second moments of RLCG interconnection lines. The proposed model considers both the effect of inductance and conductance matrices. We have performed the simulation in 0.18μm technology node and an error of as low as less as 5% has been achieved with the proposed model when compared to SPICE. The importance of the conductance matrices in interconnect modelling has also been discussed and it is shown that if G is neglected for interconnect line modelling, then it will result an delay error of as high as 6% when compared to SPICE.