Physical Verification Flow on Multiple Foundries

This paper will discuss how we optimize our physical verification flow in our IC Design Department having various rule decks from multiple foundries. Our ultimate goal is to achieve faster time to tape-out and avoid schedule delay. Currently the physical verification runtimes and memory usage have drastically increased with the increasing number of design rules, design complexity, and the size of the chips to be verified. To manage design violations, we use a number of solutions to reduce the amount of violations needed to be checked by physical verification engineers. The most important functions in physical verifications are DRC (design rule check), LVS (layout vs. schematic), and XRC (extraction). Since we have a multiple number of foundries for our design tape-outs, we need a flow that improve the overall turnaround time and ease of use of the physical verification process. The demand for fast turnaround time is even more critical since the physical design is the last stage before sending the layout to the foundries.

Spectroscopic Characterization of Indium-Tin Laser Ablated Plasma

In the present research work we present the optical emission studies of the Indium (In) – Tin (Sn) plasma produced by the first (1064 nm) harmonic of an Nd: YAG nanosecond pulsed laser. The experimentally observed line profiles of neutral Indium (In I) and Tin (SnI) are used to extract the electron temperature (Te) using the Boltzmann plot method. Whereas, the electron number density (Ne) has been determined from the Stark broadening line profile method. The Te is calculated by varying the distance from the target surface along the line of propagation of plasma plume and also by varying the laser irradiance. Beside we have studied the variation of Ne as a function of laser irradiance as well as its variation with distance from the target surface.