Experimental Study on Slicing of Sapphire with Fixed Abrasive Diamond Wire Saw

Experimental study on slicing of sapphire with fixed abrasive diamond wire saw was conducted in this paper. The process parameters were optimized through orthogonal experiment of three factors and four levels. The effects of wire speed, feed speed and tension pressure on the surface roughness were analyzed. Surface roughness in cutting direction and feed direction were both detected. The results show that feed speed plays the most significant role on the surface roughness of sliced sapphire followed by wire speed and tension pressure. The optimized process parameters are as follows: wire speed 1.9 m/s, feed speed 0.187 mm/min and tension pressure 0.18 MPa. In the end, the results were verified by analysis of variance.

An Address-Oriented Transmit Mechanism for GALS NoC

Since Network-on-Chip (NoC) uses network interfaces (NIs) to improve the design productivity, by now, there have been a few papers addressing the design and implementation of a NI module. However, none of them considered the difference of address encoding methods between NoC and the traditional bus-shared architecture. On the basis of this difference, in the paper, we introduce a transmit mechanism to solve such a problem for global asynchronous locally synchronous (GALS) NoC. Furthermore, we give the concrete implementation of the NI module in this transmit mechanism. Finally, we evaluate its performance and area overhead by a VHDL-based cycle-accurate RTL model and simulation results confirm the validity of this address-oriented transmit mechanism.

Dual-Link Hierarchical Cluster-Based Interconnect Architecture for 3D Network on Chip

Network on Chip (NoC) has emerged as a promising on chip communication infrastructure. Three Dimensional Integrate Circuit (3D IC) provides small interconnection length between layers and the interconnect scalability in the third dimension, which can further improve the performance of NoC. Therefore, in this paper, a hierarchical cluster-based interconnect architecture is merged with the 3D IC. This interconnect architecture significantly reduces the number of long wires. Since this architecture only has approximately a quarter of routers in 3D mesh-based architecture, the average number of hops is smaller, which leads to lower latency and higher throughput. Moreover, smaller number of routers decreases the area overhead. Meanwhile, some dual links are inserted into the bottlenecks of communication to improve the performance of NoC. Simulation results demonstrate our theoretical analysis and show the advantages of our proposed architecture in latency, throughput and area, when compared with 3D mesh-based architecture.

A Purpose Based Usage Access Control Model

As privacy becomes a major concern for consumers and enterprises, many research have been focused on the privacy protecting technology in recent years. In this paper, we present a comprehensive approach for usage access control based on the notion purpose. In our model, purpose information associated with a given data element specifies the intended use of the subjects and objects in the usage access control model. A key feature of our model is that it allows when an access is required, the access purpose is checked against the intended purposes for the data item. We propose an approach to represent purpose information to support access control based on purpose information. Our proposed solution relies on usage access control (UAC) models as well as the components which based on the notions of the purpose information used in subjects and objects. Finally, comparisons with related works are analyzed.