Abstract: The use of electronic sensors in the electronics
industry has become increasingly popular over the past few years,
and it has become a high competition product. The frequency
adjustment process is regarded as one of the most important process
in the electronic sensor manufacturing process. Due to inaccuracies
in the frequency adjustment process, up to 80% waste can be caused
due to rework processes; therefore, this study aims to provide a
preliminary understanding of the role of parameters used in the
frequency adjustment process, and also make suggestions in order to
further improve performance. Four parameters are considered in this
study: air pressure, dispensing time, vacuum force, and the distance
between the needle tip and the product. A full factorial design for
experiment 2k was considered to determine those parameters that
significantly affect the accuracy of the frequency adjustment process,
where a deviation in the frequency after adjustment and the target
frequency is expected to be 0 kHz. The experiment was conducted on
two levels, using two replications and with five center-points added.
In total, 37 experiments were carried out. The results reveal that air
pressure and dispensing time significantly affect the frequency
adjustment process. The mathematical relationship between these
two parameters was formulated, and the optimal parameters for air
pressure and dispensing time were found to be 0.45 MPa and 458 ms,
respectively. The optimal parameters were examined by carrying out
a confirmation experiment in which an average deviation of 0.082
kHz was achieved.
Abstract: Void formation in underfill is considered as failure
in flip chip manufacturing process. Void formation possibly caused
by several factors such as poor soldering and flux residue during
die attach process, void entrapment due moisture contamination,
dispense pattern process and setting up the curing process. This
paper presents the comparison of single step and two steps curing
profile towards the void and black dots formation in underfill for
Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA).
Statistic analysis was conducted to analyze how different factors
such as wafer lot, sawing technique, underfill fillet height and
curing profile recipe were affected the formation of voids and
black dots. A C-Mode Scanning Aqoustic Microscopy (C-SAM)
was used to scan the total count of voids and black dots. It was
shown that the 2 steps curing profile provided solution for void
elimination and black dots in underfill after curing process.
Abstract: This paper offers a case study, in which
methodological aspects of cell design for transformation the
production process are applied. The cell redesign in this work is
tightly focused to reach optimization of material flows under real
manufacturing conditions. Accordingly, more individual techniques
were aggregated into compact methodical procedure with aim to built
one-piece flow production. Case study was concentrated on relatively
typical situation of transformation from batch production to cellular
manufacturing.
Abstract: Thailand is the agriculture country as the weather and geography are suitable for agriculture environment. In 2011, the quantity of exported fresh vegetable was 126,069 tons which valued 117.1 million US dollars. Although the fresh vegetable has a high potential in exporting, there also have a lack of knowledge such as chemical usage, land usage, marketing and also the transportation and logistics. Nakorn Pathom province is the area which the farmer and manufacturer of fresh vegetable located. The objectives of this study are to study the basic information of the local fresh vegetable farmers in Nakorn Pathom province, to study the factor which effects the management of the fresh vegetable supply chain in Nakorn Pathom province and to study the problems and obstacle of the fresh vegetable supply chain in Nakorn Pathom province. This study is limited to the flow of the Nakorn Pathom province fresh vegetable from the farmers to the country which import the vegetable from Thailand. The populations of this study are 100 local farmers in Nakorn Pathom province. The result of this study shows that the key process of the fresh vegetable supply chain is in the supply sourcing process and manufacturing process.
Abstract: Shipping comb is mounted on Head Stack Assembly
(HSA) to prevent collision of the heads, maintain the gap between
suspensions and protect HSA tips from unintentional contact
damaged in the manufacturing process. Failure analysis of shipping
comb in hard disk drive production processes is proposed .Field
observations were performed to determine the fatal areas on shipping
comb and their failure fraction. Root cause failure analysis (RCFA) is
applied to specify the failure causes subjected to various loading
conditions. For reliability improvement, failure mode and effects
analysis (FMEA) procedure to evaluate the risk priority is performed.
Consequently, the more suitable information design criterions were
obtained.