The Mechanical and Electrochemical Properties of DC-Electrodeposited Ni-Mn Alloy Coating with Low Internal Stress
The nickel-manganese (Ni-Mn) alloy coating prepared
from DC electrodeposition process in sulphamate bath was studied.
The effects of process parameters, such as current density and
electrolyte composition, on the cathodic current efficiency,
microstructure, internal stress and mechanical properties were
investigated. Because of its crucial effect on the application to the
electroforming of microelectronic components, the development of
low internal stress coating with high leveling power was emphasized.
It was found that both the coating’s manganese content and the
cathodic current efficiency increased with the raise in current density.
In addition, the internal stress of the deposited coating showed
compressive nature at low current densities while changed to tensile
one at higher current densities. Moreover, the metallographic
observation, X-ray diffraction measurement, and polarization curve
measurement were conducted. It was found that the Ni-Mn coating
consisted of nano-sized columnar grains and the maximum hardness of
the coating was associated with (111) preferred orientation in the
microstructure. The grain size was refined along with the increase in
the manganese content of the coating, which accordingly, raised its
hardness and resistance to annealing softening. In summary, the
Ni-Mn coating prepared at lower current density of 1-2 A/dm2 had low
internal stress, high leveling power, and better corrosion resistance.
[1] L. T. Romankiw, “A Path: From Electroplating Through Lithographic
Masks in Electronics to LIGA in MENS,” Electrochimica Acta, vol. 41,
no. 20-22, 1997, pp. 2985-3005.
[2] K. H. Cheng, F. J. Chen, C. Y. Lee, C. S. Lin, J. T. Huang, C. C. Lan, P. H.
Tsou, T. I. Ho, ”Fabrication of Ni-Mn Microprobe Structure with Low
Internal Stress and High Hardness by Employing DC Electrodeposition,”
Advances in Materials Science and Engineering, vol. 2014, 2014, Article
ID 890814, 6 pages.
[3] G. A. Malone, “New Developments in Electroformed Nickel-Based
Structural Alloys,” Plating and Surface Finishing, 1987, vol. 74, pp.
50-56.
[4] R. J. Tzou, H. S. Chou, “The Electroforming of Nickel-Based Alloys,”
Journal of Chinese Corrosion Engineering, vol.6, no.3,1992, pp.32 -38
[5] N. Y. C. Yang, T. J. Headley, “Metallurgy of High Strength Ni-Mn
Microsystems Fabricated by Electrodeposition,” Scripta Materialia,
vol.51, 2004, pp.761 -766.
[6] A. V. Ryazhkin, Yu. A. Babanov, T. Miyanaga, T. Ogasawara, K. Nitta, S.
Ohwada, V. P. Pilyugin, A. M. Patchelov, E. G. Chernyishov, ”Lattice
Parameters for Ni-Mn Disordered Alloys by EXAFS,” Materials Science,
vol.12C, vol.22, 2005, pp.131.
[7] S. H. Goods, J. J. Kelly, N. Y. C. Yang, “Electrodeposited Nickel-
Manganese: An Alloy for Microsystem Applications,” Microsystem
Technologies, vol.10, 2004, pp. 498-505.
[8] E. A. Marquis, A. A. Talin, “Effect of Current Density on the Structure of
Ni and Ni-Mn Electrodeposits,” Journal of Materials Engineering,
vol.36, 2006, pp.669-676.
[9] N. Atanassov, V. Mitreva, “Electrodeposition and Properties of
Nickel-Manganese Layers,” Surface & Coating Technology, vol.78,
1996, pp. 144-149.
[10] W. B. Stephenson, Fermer Jr., “Development and Utilization of a High
Strength Alloy for Electroform,” Plating, vol. 52, no. 2, 1966, pp.183-
192.
[11] W. B. Stephenson, Cincinnati, Jr., R. F. Edward, “Electrodepostion of a
Nickel-Manganese Alloy,” US Patent No. 3244603, 1968.
[12] A. Stephen, “Corrosion Behaviour of Electrodeposited Ni-Mn Alloys-
Electrochemical Impedance Measurements,” Anti-Corrosion Methods
and Materials, Vol.46, no.2, 1999, pp.117 – 121.
[13] W. R. Wearmouth, K. C. Belt, “Electroforming with Heat-resistant,
Sulfur-hardened Nickel,” Plating, vol. 66, no. 10, 1979, pp.53-57.
[14] W. R. Wearmouth, “Hard, Heat-resistant Nickel Electrodeposits,” US
Patent No. 4108740, 1977.
[15] G. A. Malone, “Study of High Performance Alloy Electroforming,”
NASA-CR- 173828, US NTIS, 1984.
[16] G. A. Malone, “Study of High Performance Alloy Electroforming,”
NASA-CR- 175494, US NTIS, 1985.
[17] J. W. Dini, H. R. Johnson, “High-Temperature Ductility of Electrodeposited
Nickel,” SAND77-8020, US Sandia Laboratories.
[18] J. W. Dini, H. R. Johnson, L. A. West, “On the High-Temperature
Ductility Properties of Electrodeposited Sulfamate Nickel,” Plating, vol.
65, no. 2, 1978, pp.36-40.
[19] J. J. Kelly, S. H. Goods, “High Performance Nanostructured Ni-Mn Alloy
for Microsystem Applications,” Electrochemical and Solid – State
Letters, vol.6, no.6, 2003, pp.C81 – C91.
[20] G. Lucadamo, D. L. Medlin, “Characterization of Twinning in Electrodeposited
Ni-Mn Alloys,” Philosophical Magazine, vol.85, vol.22, 2005,
pp.2549 – 2560.
[21] F. J. Chen, “Study on Hexavalent Chromium Process Alternatives”, Ph.D.
Dissertation, Department of Mechanical Engineering, National Taiwan
University, Taipei, Taiwan, Nov. 2009.
[22] Y. Tsuru, M. Nomura, “Effects of Chloride, Bromide and Iodide Ions on
Internal Stress in Films Deposited during High Speed Nickel
Electroplating from a Nickel Sulfamate Bath,” Journal of Applied
Electrochemistry, vol.30, 2000, pp.231 – 238.
[23] A. Stephen, “Magnetic Properties of Electrodeposited Nickel-Manganese
Alloys: Effect of Ni/Mn Bath Ratio,” Journal of Applied
Electrochemistry, vol. 30, 2000, pp.1313 – 1316.
[24] M. Pushpavanam, V. Raman, “Leveling in Bright Nickel-Iron,” Metal
Finishing, vol. 84, no. 5, 1986, pp.51-55.
[25] S. J. Hearne, J. A. Floro, M. A. Rodriguez, R. T. Tissot, C. S. Frazer, L.
Brewer, P. Hlava, and S. Foiles, “Stress Creation during Ni-Mn Alloy
Electrodeposition,” Journal of Applied Physics, vol.99, 2006,
pp.053517_1 – 053517_4.
[26] M. A. Meyers and K. K. Chawla, Mechanical Behavior of Materials,
Prentice Hall, New Jersey, US, 1999.
[27] C. W. Chu, “Effects of Manganese Doped Ba1.002(Ti0.82Zr0.18)O3+δ
on Insulation Resistance and Dielectric Properties,” Master Thesis,
Department of Materials Science and Engineering, National Cheng-Kung
University, Tainan, Taiwan, June 2005.
[1] L. T. Romankiw, “A Path: From Electroplating Through Lithographic
Masks in Electronics to LIGA in MENS,” Electrochimica Acta, vol. 41,
no. 20-22, 1997, pp. 2985-3005.
[2] K. H. Cheng, F. J. Chen, C. Y. Lee, C. S. Lin, J. T. Huang, C. C. Lan, P. H.
Tsou, T. I. Ho, ”Fabrication of Ni-Mn Microprobe Structure with Low
Internal Stress and High Hardness by Employing DC Electrodeposition,”
Advances in Materials Science and Engineering, vol. 2014, 2014, Article
ID 890814, 6 pages.
[3] G. A. Malone, “New Developments in Electroformed Nickel-Based
Structural Alloys,” Plating and Surface Finishing, 1987, vol. 74, pp.
50-56.
[4] R. J. Tzou, H. S. Chou, “The Electroforming of Nickel-Based Alloys,”
Journal of Chinese Corrosion Engineering, vol.6, no.3,1992, pp.32 -38
[5] N. Y. C. Yang, T. J. Headley, “Metallurgy of High Strength Ni-Mn
Microsystems Fabricated by Electrodeposition,” Scripta Materialia,
vol.51, 2004, pp.761 -766.
[6] A. V. Ryazhkin, Yu. A. Babanov, T. Miyanaga, T. Ogasawara, K. Nitta, S.
Ohwada, V. P. Pilyugin, A. M. Patchelov, E. G. Chernyishov, ”Lattice
Parameters for Ni-Mn Disordered Alloys by EXAFS,” Materials Science,
vol.12C, vol.22, 2005, pp.131.
[7] S. H. Goods, J. J. Kelly, N. Y. C. Yang, “Electrodeposited Nickel-
Manganese: An Alloy for Microsystem Applications,” Microsystem
Technologies, vol.10, 2004, pp. 498-505.
[8] E. A. Marquis, A. A. Talin, “Effect of Current Density on the Structure of
Ni and Ni-Mn Electrodeposits,” Journal of Materials Engineering,
vol.36, 2006, pp.669-676.
[9] N. Atanassov, V. Mitreva, “Electrodeposition and Properties of
Nickel-Manganese Layers,” Surface & Coating Technology, vol.78,
1996, pp. 144-149.
[10] W. B. Stephenson, Fermer Jr., “Development and Utilization of a High
Strength Alloy for Electroform,” Plating, vol. 52, no. 2, 1966, pp.183-
192.
[11] W. B. Stephenson, Cincinnati, Jr., R. F. Edward, “Electrodepostion of a
Nickel-Manganese Alloy,” US Patent No. 3244603, 1968.
[12] A. Stephen, “Corrosion Behaviour of Electrodeposited Ni-Mn Alloys-
Electrochemical Impedance Measurements,” Anti-Corrosion Methods
and Materials, Vol.46, no.2, 1999, pp.117 – 121.
[13] W. R. Wearmouth, K. C. Belt, “Electroforming with Heat-resistant,
Sulfur-hardened Nickel,” Plating, vol. 66, no. 10, 1979, pp.53-57.
[14] W. R. Wearmouth, “Hard, Heat-resistant Nickel Electrodeposits,” US
Patent No. 4108740, 1977.
[15] G. A. Malone, “Study of High Performance Alloy Electroforming,”
NASA-CR- 173828, US NTIS, 1984.
[16] G. A. Malone, “Study of High Performance Alloy Electroforming,”
NASA-CR- 175494, US NTIS, 1985.
[17] J. W. Dini, H. R. Johnson, “High-Temperature Ductility of Electrodeposited
Nickel,” SAND77-8020, US Sandia Laboratories.
[18] J. W. Dini, H. R. Johnson, L. A. West, “On the High-Temperature
Ductility Properties of Electrodeposited Sulfamate Nickel,” Plating, vol.
65, no. 2, 1978, pp.36-40.
[19] J. J. Kelly, S. H. Goods, “High Performance Nanostructured Ni-Mn Alloy
for Microsystem Applications,” Electrochemical and Solid – State
Letters, vol.6, no.6, 2003, pp.C81 – C91.
[20] G. Lucadamo, D. L. Medlin, “Characterization of Twinning in Electrodeposited
Ni-Mn Alloys,” Philosophical Magazine, vol.85, vol.22, 2005,
pp.2549 – 2560.
[21] F. J. Chen, “Study on Hexavalent Chromium Process Alternatives”, Ph.D.
Dissertation, Department of Mechanical Engineering, National Taiwan
University, Taipei, Taiwan, Nov. 2009.
[22] Y. Tsuru, M. Nomura, “Effects of Chloride, Bromide and Iodide Ions on
Internal Stress in Films Deposited during High Speed Nickel
Electroplating from a Nickel Sulfamate Bath,” Journal of Applied
Electrochemistry, vol.30, 2000, pp.231 – 238.
[23] A. Stephen, “Magnetic Properties of Electrodeposited Nickel-Manganese
Alloys: Effect of Ni/Mn Bath Ratio,” Journal of Applied
Electrochemistry, vol. 30, 2000, pp.1313 – 1316.
[24] M. Pushpavanam, V. Raman, “Leveling in Bright Nickel-Iron,” Metal
Finishing, vol. 84, no. 5, 1986, pp.51-55.
[25] S. J. Hearne, J. A. Floro, M. A. Rodriguez, R. T. Tissot, C. S. Frazer, L.
Brewer, P. Hlava, and S. Foiles, “Stress Creation during Ni-Mn Alloy
Electrodeposition,” Journal of Applied Physics, vol.99, 2006,
pp.053517_1 – 053517_4.
[26] M. A. Meyers and K. K. Chawla, Mechanical Behavior of Materials,
Prentice Hall, New Jersey, US, 1999.
[27] C. W. Chu, “Effects of Manganese Doped Ba1.002(Ti0.82Zr0.18)O3+δ
on Insulation Resistance and Dielectric Properties,” Master Thesis,
Department of Materials Science and Engineering, National Cheng-Kung
University, Tainan, Taiwan, June 2005.
@article{"International Journal of Mechanical, Industrial and Aerospace Sciences:70769", author = "Chun-Ying Lee and Kuan-Hui Cheng and Mei-Wen Wu", title = "The Mechanical and Electrochemical Properties of DC-Electrodeposited Ni-Mn Alloy Coating with Low Internal Stress", abstract = "The nickel-manganese (Ni-Mn) alloy coating prepared
from DC electrodeposition process in sulphamate bath was studied.
The effects of process parameters, such as current density and
electrolyte composition, on the cathodic current efficiency,
microstructure, internal stress and mechanical properties were
investigated. Because of its crucial effect on the application to the
electroforming of microelectronic components, the development of
low internal stress coating with high leveling power was emphasized.
It was found that both the coating’s manganese content and the
cathodic current efficiency increased with the raise in current density.
In addition, the internal stress of the deposited coating showed
compressive nature at low current densities while changed to tensile
one at higher current densities. Moreover, the metallographic
observation, X-ray diffraction measurement, and polarization curve
measurement were conducted. It was found that the Ni-Mn coating
consisted of nano-sized columnar grains and the maximum hardness of
the coating was associated with (111) preferred orientation in the
microstructure. The grain size was refined along with the increase in
the manganese content of the coating, which accordingly, raised its
hardness and resistance to annealing softening. In summary, the
Ni-Mn coating prepared at lower current density of 1-2 A/dm2 had low
internal stress, high leveling power, and better corrosion resistance.", keywords = "DC plating, internal stress, leveling power, Ni-Mn
coating.", volume = "9", number = "7", pages = "1340-5", }
