Development of Thermal Model by Performance Verification of Heat Pipe Subsystem for Electronic Cooling under Space Environment
Heat pipes are used to control the thermal problem for
electronic cooling. It is especially difficult to dissipate heat to a heat
sink in an environment in space compared to earth. For solving this
problem, in this study, the Poiseuille (Po) number, which is the main
measure of the performance of a heat pipe, is studied by CFD; then, the
heat pipe performance is verified with experimental results. A heat
pipe is then fabricated for a spatial environment, and an in-house code
is developed. Further, a heat pipe subsystem, which consists of a heat
pipe, MLI (Multi Layer Insulator), SSM (Second Surface Mirror), and
radiator, is tested and correlated with the TMM (Thermal
Mathematical Model) through a commercial code. The correlation
results satisfy the 3K requirement, and the generated thermal model is
verified for application to a spatial environment.
[1] K. H. OH, M.K. LEE, and S.H.JEONG, "Design and fabrication of a
metallic micro-heat pipe based on high-aspect-ratio microchannels," Heat
transfer engineering, vol. 28, pp. 8-9, 2007.
[2] C. Aghanajafi, V. Vandadi, M.R. Shahnazari, " Investigation of
Convection and Radiation Heat Transfer in Rhombus Microchannels," Int.
J. Research and Reviews in Applied Sciences, vol 3. Issue 2, 2010
[3] S.J. Park, S. Cjung, H.W. Bang, C.I. Chung, D.C. Han, J.K. Chang,
"Modeling and Designing of Microfludic System Using Poiseuille
Number," 2nd Annual International IEEE-EMBS Special Topic
Conference on Microtechnologies in Medicine and Bilology.
Proceedings(Cat.No.02EX578), 2002
[4] S.H. Jin and J.H. Boo, "Performance Analysis of a Heat Pipe Radiator for
Thermal Control of Satellites," unpublished, 1992
[5] N. Damean, P.P.L. Regtien, "Poiseuille number for the fully developed
laminar flow through hexagonal ducts etched in <100> silicon," Sensors
and Actuators A, vol. 90, pp. 96-101, 2001
[6] R.K. Shah, "Laminar flow friction and forced convection heat transfer in
ducts of arbitrary geometry," Int. J. Heat Transfer, vol. 18, pp. 849-862,
1975
[7] A. Faghri and M. Buchko "Experimental and Numerical Analysis of
Low-Temperature Heat Pipes with Multiple Heat Sources" Transactions
of ASME: Journal of Heat Transfer, Vol. 113, pp. 728-734, 1991
[8] Chi, S.W., Heat Pipe Theory and Practice, New York, pp 54, 1976
[9] T.H. Kim, "An Experimental Study on Estimation of Heat Transport
Capability for the Cross Section of Axially Grooved Heat Pipes",
unpublished, 2001
[10] Gilmore, David G.,"Spacecraft Thermla Control Handbook", The
Aerospace Press, El Segundo, CA., 2002
[11] "SINDA/FLUINT User-s Manual, Version 5.2", 2009, Cullimore and
Ring Technologies, Inc.
[1] K. H. OH, M.K. LEE, and S.H.JEONG, "Design and fabrication of a
metallic micro-heat pipe based on high-aspect-ratio microchannels," Heat
transfer engineering, vol. 28, pp. 8-9, 2007.
[2] C. Aghanajafi, V. Vandadi, M.R. Shahnazari, " Investigation of
Convection and Radiation Heat Transfer in Rhombus Microchannels," Int.
J. Research and Reviews in Applied Sciences, vol 3. Issue 2, 2010
[3] S.J. Park, S. Cjung, H.W. Bang, C.I. Chung, D.C. Han, J.K. Chang,
"Modeling and Designing of Microfludic System Using Poiseuille
Number," 2nd Annual International IEEE-EMBS Special Topic
Conference on Microtechnologies in Medicine and Bilology.
Proceedings(Cat.No.02EX578), 2002
[4] S.H. Jin and J.H. Boo, "Performance Analysis of a Heat Pipe Radiator for
Thermal Control of Satellites," unpublished, 1992
[5] N. Damean, P.P.L. Regtien, "Poiseuille number for the fully developed
laminar flow through hexagonal ducts etched in <100> silicon," Sensors
and Actuators A, vol. 90, pp. 96-101, 2001
[6] R.K. Shah, "Laminar flow friction and forced convection heat transfer in
ducts of arbitrary geometry," Int. J. Heat Transfer, vol. 18, pp. 849-862,
1975
[7] A. Faghri and M. Buchko "Experimental and Numerical Analysis of
Low-Temperature Heat Pipes with Multiple Heat Sources" Transactions
of ASME: Journal of Heat Transfer, Vol. 113, pp. 728-734, 1991
[8] Chi, S.W., Heat Pipe Theory and Practice, New York, pp 54, 1976
[9] T.H. Kim, "An Experimental Study on Estimation of Heat Transport
Capability for the Cross Section of Axially Grooved Heat Pipes",
unpublished, 2001
[10] Gilmore, David G.,"Spacecraft Thermla Control Handbook", The
Aerospace Press, El Segundo, CA., 2002
[11] "SINDA/FLUINT User-s Manual, Version 5.2", 2009, Cullimore and
Ring Technologies, Inc.
@article{"International Journal of Mechanical, Industrial and Aerospace Sciences:54733", author = "MK Lee and JS Hong and SM Sin and HU Oh", title = "Development of Thermal Model by Performance Verification of Heat Pipe Subsystem for Electronic Cooling under Space Environment", abstract = "Heat pipes are used to control the thermal problem for
electronic cooling. It is especially difficult to dissipate heat to a heat
sink in an environment in space compared to earth. For solving this
problem, in this study, the Poiseuille (Po) number, which is the main
measure of the performance of a heat pipe, is studied by CFD; then, the
heat pipe performance is verified with experimental results. A heat
pipe is then fabricated for a spatial environment, and an in-house code
is developed. Further, a heat pipe subsystem, which consists of a heat
pipe, MLI (Multi Layer Insulator), SSM (Second Surface Mirror), and
radiator, is tested and correlated with the TMM (Thermal
Mathematical Model) through a commercial code. The correlation
results satisfy the 3K requirement, and the generated thermal model is
verified for application to a spatial environment.", keywords = "CFD, Heat pipe, Radiator, Space.", volume = "4", number = "10", pages = "975-5", }