Parametric Analysis in the Electronic Sensor Frequency Adjustment Process

The use of electronic sensors in the electronics industry has become increasingly popular over the past few years, and it has become a high competition product. The frequency adjustment process is regarded as one of the most important process in the electronic sensor manufacturing process. Due to inaccuracies in the frequency adjustment process, up to 80% waste can be caused due to rework processes; therefore, this study aims to provide a preliminary understanding of the role of parameters used in the frequency adjustment process, and also make suggestions in order to further improve performance. Four parameters are considered in this study: air pressure, dispensing time, vacuum force, and the distance between the needle tip and the product. A full factorial design for experiment 2k was considered to determine those parameters that significantly affect the accuracy of the frequency adjustment process, where a deviation in the frequency after adjustment and the target frequency is expected to be 0 kHz. The experiment was conducted on two levels, using two replications and with five center-points added. In total, 37 experiments were carried out. The results reveal that air pressure and dispensing time significantly affect the frequency adjustment process. The mathematical relationship between these two parameters was formulated, and the optimal parameters for air pressure and dispensing time were found to be 0.45 MPa and 458 ms, respectively. The optimal parameters were examined by carrying out a confirmation experiment in which an average deviation of 0.082 kHz was achieved.

Authors:

• Rungchat Chompu-Inwai
• Akararit Charoenkasemsuk

Keywords:

• Design of Experiment
• Electronic Sensor
• Frequency Adjustment
• Parametric Analysis

References:

[1] N. Phanruangrong, Factor Analysis for Alumina Substrate Sheet
Cracking Reduction Using Design of Experiment Technique,
Independent Study, Master of Science, Chiang Mai University, 2008.
[2] R. Kuldilok, Improvement of Curing Performance in Casting Process for
Quad Flat no Leads Product Using Design of Experiment Technique,
Independent Study, Master of Science, Chiang Mai University, 2007.
[3] A. Sukmee, An Experimental Design Study of Suitable factors for
Soldering Printed Circuit Boards Using the Wave Soldering Process,
Thesis, Master of Engineering, King Mongkut's Institute of Technology
North Bangkok, 2003.
[4] W. Taweesuk, A Study of Factors Affecting the Crown Inducement of
Write/Read Head Assembly of Hard Drive Using Design of Experiment,
Thesis, Master of Engineering, Chulalongkorn University, 2003.
[5] Y. Taechavijit, Gold Mask Dry Film defect Reduction of Flexible
Printed Circuit Using Design of Experiment Technique, Independent
Study, Master of Science, Chiang Mai University, 2007.
[6] L. Jianping, and D. Guiling, "Technology development and basic theory
study of fluid dispensing - a review," in Proc. IEEE CPMT Conference,
2004, pp. 198-205.
[7] C. P. Chen, and H. Ding, "Run by Run control of time-pressure
dispensing for electronics encapsulation," The International Journal of
Automation and Computing, vol.5, no.4, pp. 419-424, 2008.
[8] C. P. Chen, H. X. Li, and H. Ding, "Modeling and control of timepressure
dispensing for semiconductor manufacturing," The
International Journal of Automation and Computing, vol.4, no.4, pp.
422-427, 2007.
[9] K. Y. Chan, C. K. Kwong, and Y. C. Tsim, "Modeling and optimization
of fluid dispensing for electronic packaging using Neural Fuzzy
Network and Genetic Algorithm," The Engineering Application of
Artificial Intelligence, vol.23, no.1, pp. 18-26, 2010.
[10] C. K. Kwong, K. Y. Chan, and H. Wong, "An empirical approach to
modeling fluid dispensing for electronic packaging," The International
Journal of Advanced Manufacturing Technology, vol.34, pp. 111-121,
2006.
[11] D.C. Montgomery. Design and Analysis of Experiment, USA: John
Wiley Sons Inc, 2009.