Second-Order Slip Flow and Heat Transfer in a Long Isoflux Microchannel

This paper presents a study on the effect of
second-order slip on forced convection through a long isoflux heated
or cooled planar microchannel. The fully developed solutions of flow
and thermal fields are analytically obtained on the basis of the
second-order Maxwell-Burnett slip and local heat flux boundary
conditions. Results reveal that when the average flow velocity
increases or the wall heat flux amount decreases, the role of thermal
creep becomes more insignificant, while the effect of second-order slip
becomes larger. The second-order term in the Deissler slip boundary
condition is found to contribute a positive velocity slip and then to lead
to a lower pressure drop as well as a lower temperature rise for the
heated-wall case or to a higher temperature rise for the cooled-wall
case. These findings are contrary to predictions made by the
Karniadakis slip model.

• Huei Chu Weng

• Microfluidics
• forced convection
• thermal creep
• second-order boundary conditions.

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