Flat Miniature Heat Pipes for Electronics Cooling: State of the Art, Experimental and Theoretical Analysis
An experimental study is realized in order to verify the
Mini Heat Pipe (MHP) concept for cooling high power dissipation
electronic components and determines the potential advantages of
constructing mini channels as an integrated part of a flat heat pipe. A
Flat Mini Heat Pipe (FMHP) prototype including a capillary structure
composed of parallel rectangular microchannels is manufactured and
a filling apparatus is developed in order to charge the FMHP. The
heat transfer improvement obtained by comparing the heat pipe
thermal resistance to the heat conduction thermal resistance of a
copper plate having the same dimensions as the tested FMHP is
demonstrated for different heat input flux rates. Moreover, the heat
transfer in the evaporator and condenser sections are analyzed, and
heat transfer laws are proposed. In the theoretical part of this work, a
detailed mathematical model of a FMHP with axial microchannels is
developed in which the fluid flow is considered along with the heat
and mass transfer processes during evaporation and condensation.
The model is based on the equations for the mass, momentum and
energy conservation, which are written for the evaporator, adiabatic,
and condenser zones. The model, which permits to simulate several
shapes of microchannels, can predict the maximum heat transfer
capacity of FMHP, the optimal fluid mass, and the flow and thermal
parameters along the FMHP. The comparison between experimental
and model results shows the good ability of the numerical model to
predict the axial temperature distribution along the FMHP.
[1] M. Groll, M. Schneider, V. Sartre, M.C. Zaghdoudi, and M. Lallemand,
"Thermal Control of electronic equipment by heat pipes," Revue
Générale de Thermique, vol. 37, no. 5, 1998, pp. 323-352.
[2] T.P. Cotter, "Principles and Prospects of Micro Heat Pipes," 5th
International Heat Pipe Conference, Tsukuba, Japan, May 14-18, 1984,
pp. 328-335.
[3] A. Itoh, and F. Polasek, "Development and Application of Micro Heat
pipes," 7th International Heat Pipe Conference, Minsk, Russia, May 21-
25, 1990.
[4] Z. Ji, W. Caiyou, Y. Xiuqin, and Z. Zeqing, "Experimental Investigation
of the Heat Transfer Characteristics of the Micro Heat Pipes," 8th
International Heat Pipe Conference, Bejing, China, September 14-18,
1992, pp. 416-420.
[5] B.R. Babin, G.P. Peterson, and D. Wu, "Analysis and Testing of a
Micro Heat Pipe During Steady-State," ASME/AIchE National Heat
Transfer Conference, Paper No. 89-HT-17, Philadelphia, Pennsyvania,
USA, August 5-8, 1989, 10p.
[6] B.R. Babin, G.P. Peterson, and D. Wu, "Steady-State Modeling and
Testing of Micro Heat Pipe," Journal of Heat Transfer, vol. 112, 1990,
pp. 595-601.
[7] D. Wu, and G.P. Peterson, "Investigation of the Transient
Characteristics of a Micro Heat Pipe," Journal of Thermophysics and
Heat Transfer, vol. 5, no. 2, 1991, pp. 129-134.
[8] D. Wu, G.P. Peterson, and W.S. Chang, "Transient Experimental
Investigation of Micro Heat pipes," Journal of Thermophysics and Heat
Transfer, vol. 5, no. 4, 1991, pp. 539-545.
[9] S.H. Moon, C.J. Kim, B.H. Kim, S.E. Hong, and J.S. Lee, "An
Experimental Study on the Performance Limitation of a Micro Heat Pipe
with Triangular Cross-Section," 10th International Heat Pipe
Conference, Tokyo, Japan, September 22-26, 1999, pp. 15-19.
[10] G.P. Peterson, "Heat Pipes in the Thermal Control of Electronic
Components," 3rd International Heat Pipe Symposium, September 12-
14, Tsukuba, Japan, 1988, pp. 2-12.
[11] G.P. Peterson, A.B. Duncan, A.S. Ahmed, A.K. Mallik, and M.H.
Weichold, "Experimental Investigation of Micro Heat Pipes in Silicon
Wafers," Micromechanical Sensors, Actuators, and Systems, DSC-Vol.
32, 1991, pp. 341-348.
[12] F.M. Gerner, "Micro Heat Pipes," AFSOR Final Report, No.S-210-
10MG-066, Wright-Patterson AFB, Dayton, OH, USA, 1990.
[13] A.K. Mallik, and G.P. Peterson, "On the Use of Micro Heat Pipes as an
Integral Part of Semiconductors," 3rd ASME-JSME Thermal
Engineering Joint Conference Proceeding, vol. 2, Reno, NV, USA,
March 17-22, 1991, pp. 394-401.
[14] F.M. Gerner, B. Badran, J.P. Longtin, P. Ramadas, T.H. Henderson, and
W.S. Chang, "Flow and Heat Transfer Limitations in Micro Heat Pipes,"
28th National Heat Transfer Conference, August 9-12, San Diego, CA,
USA, 1992, pp. 99-104.
[15] G.P. Peterson, A.B. Duncan, and M.H. Weichold, "Experimental
Investigation of Micro Heat Pipes Fabricated in Silicon Wafers,"
Journal of Heat Transfer, vol. 115, 1993, pp. 751-756.
[16] F.M. Gerner, B. Badran, H.T. Henderson, and P. Ramadas, "Silicon-
Water Micro Heat Pipes," Thermal Science Engineering, vol. 2, no.1,
1994, pp. 90-97.
[17] D. Shen, R. Mitchell, D. Dobranich, D. Adkins, and M. Tuck, "Micro
Heat Spreader Enhanced Heat Transfer in MCMs," IEEE Multi-Chip-
Module Conference, Santa Cruz, California, USA, January 31-February
2, 1995, pp. 189-194.
[18] D.A. Benson, D.R. Adkins, G.P. Peterson, R.T. Mitchell, M.R. Tuck,
and D.W. Palmer, "Turning Silicon Substrates into Diamond: Micro
Machining Heat Pipes," Advances in Design, Materials and Processes
for Thermal Spreaders and Heat Sinks Workshop, Vail, CO, USA, April
19-21, 1996, pp. 19-21.
[19] D.A. Benson, D.R. Adkins, G.P. Peterson, R.T. Mitchell, M.R. Tuck,
and D.W. Palmer, "Micro Machined Heat Pipes in Silicon MCM
Substrates," Proceeding of IEEE Multichip Module Conference, Santa
Cruz, CA, USA, November 6-7, 1996, pp. 127-129.
[20] D.A. Benson, R.T. Mitchell, M.R. Tuck, D.W. Palmer, and G.P.
Peterson, "Ultrahigh-Capacity Micromachined Heat Spreaders,"
Microscale Thermophysical Engineering, vol. 2, no.1, 1998, pp. 21-30.
[21] B. Badran, F.M. Gerner, P. Ramadas, T. Henderson, and K.W. Baker,
"Experimental Results for Low-temperature Silicon Micromachined
Micro Heat Pipe Arrays Using Water and Methanol as Working Fluids,"
Experimental Heat Transfer, vol. 10, no. 4, 1997, pp. 253-272.
[22] B. Gromoll, "Micro cooling systems for high density packaging," Revue
Générale de la Thermique, vol. 37, 1998, pp. 781-787.
[23] Y. Avenas, B. Mallet, C. Gillot, A. Bricard, C. Schaeffer, G. Poupon,
and E. Fournier, "Thermal Spreaders for High Heat Flux Power
Devices," 7th THERMINIC Workshop, Paris, France, September 24-27,
2001, pp. 59-631.
[24] Y. Avenas, M. Ivanova, N. Popova, C. Schaeffer, J.L. Schanen, and A.
Bricard, "Thermal Analysis of Thermal Spreaders Used in Power
Electronics Cooling," 37th Annual Meeting of the Industry-Applications-
Society, Conference Record of the 2002 IEEE Industry Applications
Conference, Pittsburgh, PA, USA, October 12-18, 2002, pp. 216-221.
[25] C. Gillot, Y. Avenas, N. Cezac, G. Poupon, C. Schaeffer, and E.
Fournier, "Silicon Heat Pipes Used as Thermal Spreaders," 8th
Intersociety Conference on Thermal and Thermomechanical
Phenomena in Electronic Systems (ITHERM 2002), San Diego, USA,
May 30- June 01, 2002, pp. 1052-1057.
[26] C. Gillot, Y. Avenas, N. Cezac, G. Poupon, C. Schaeffer, and E.
Fournier, "Silicon Heat Pipes Used as Thermal Spreaders," IEEE
Transactions on Components and Packaging Technologies, vol. 26, no.
2, 2003, pp. 332-339.
[27] C. Gillot, G. Poupon, Y. Avenas, C. Schaeffer, and E. Fournier, E.,
"Design and Fabrication of Flat Silicon Heat Pipes with Micro Capillary
Grooves," Houille Blanche-Revue Internationale de l-Eau, no. 4, 2003,
pp. 62-66.
[28] C. Gillot, A. Laï, M. Ivanova, Y. Avenas, C. Schaeffer, and E. Fournier,
"Experimental Study of a Flat Silicon Heat Pipe with Microcapillary
Grooves," 9th Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems (ITHERM 2004),
vol. 2, Las Vegas, NV, USA, June 1-4, 2004, pp. 47-51.
[29] M. Ivanova, C. Schaeffer, Y. Avenas, A. Laï, and C. Gillot, "Realization
and Thermal Analysis of Silicon Thermal Spreaders used in power
electronics cooling," IEEE International Conference on Industrial
Technology, vol. 1-2, Maribor, Slovenia, December 10-12, 2003 pp.
1124-1129.
[30] M. Lee, M. Wong, and Y. Zohar, "Characterization of an Integrated
Micro Heat pipe," Journal of Micromechanics and Microengineering,
Vol.13, 2003, pp. 58-64.
[31] M. Lee, M. Wong, and Y. Zohar, "Integrated Micro Heat Pipe
Fabrication Technology," Journal of Microelectromechanical Systems,
vol. 12, no. 2, 2003, pp. 138-146.
[32] A. Laï, C. Gillot, M. Ivanova, Y. Avenas, C. Louis, C. Schaeffer, and E.
Fournier, "Thermal Characterization of Flat Silicon Heat Pipes," 20th
Annual IEEE Semiconductor Thermal Measurement and Management
Symposium, San Jose, CA, USA, 9-11 March, 2004, pp. 21-25.
[33] A.K. Mallik, G.P. Peterson, and W. Weichold, "Construction Processes
for Vapor Deposited Micro Heat Pipes," 10th Symposium on Electronic
Materials Processing and Characteristics, Richardson, TX, USA, June
3-4, 1991.
[34] A.K. Mallik, G.P. Peterson, and M.H. Weichold, "On the Use of Micro
Heat Pipes as an Integral Part of Semiconductor Devices," Journal of
Electronic Packaging, vol. 114, 1992, pp. 436-442.
[35] M.H. Weichold, G.P. Peterson, and A. Mallik, "Vapor Deposited Micro
Heat Pipes," U.S. Patent 5,179,043, 1993.
[36] G.P. Peterson, and A.K. Mallik, "Steady-State Investigation of Vapor
Deposited Micro Heat Pipe Arrays," Journal of Electronic Packaging,
vol. 117, no. 1, 1995, pp. 75-81.
[37] G.P. Peterson, and A.K. Mallik, "Transient Response of Vapor
Deposited Micro Heat Pipe Arrays," Journal of Electronic Packaging,
vol. 117, no. 1, 1995, pp. 82-87.
[38] D.R. Adkins, D.S. Shen, D.W. Palmer, and M.R. Tuck, "Silicon Heat
Pipes for Cooling Electronics," Proceeding of 1st Annual Spacecraft
Thermal Control Symposium, Albuquerque, NM, USA, November 16-
18, 1994, 11p.
[39] M. Le Berre, S. Launay, V. Sartre, and M. Lallemand, "Fabrication and
Experimental Investigation of Silicon Micro Heat Pipes for Cooling
Electronics," Journal of Micromechanics and Microengineering, vol.
13, no. 3, 2003, pp. 436-441.
[40] S. Launay, M. Le Berre, V. Sartre, P. Morfouli, J. Boussey, D. Barbier,
and M. Lallemand, "Fabrication of Silicon Micro Heat Pipes for Cooling
Electronics," Houille Blanche-Revue Internationale de l-Eau, no. 4,
2003, pp. 82-87.
[41] S. Launay, V. Sartre, and M. Lallemand, "Experimental Study on
Silicon Micro Heat Pipe Arrays," Applied Thermal Engineering, vol.
24, 2004, pp. 233-243.
[42] M. Le Berre, G. Pandraud, and P. Morfouli, "The performance of Micro
Heat Pipes Measured by Integrated Sensors," Journal of
Micromechanical Microengineering, vol. 16, no. 5, 2006, pp. 1047-
1050.
[43] G. Pandraud, M. Le Berre, P. Morfouli, and M. Lallemand, "Influence of
the fluid on the experimental performances of triangular silicon micro
heat pipes," Journal of Electronic Packaging, vol. 128, no. 3, 2006, pp.
294-296.
[44] D.K. Harris, A. Palkar, G. Woncott, R. Dean, and F. Simionescu, "An
Experimental Investigation in the Performance of Water-filled Silicon
Microheat Pipe Arrays," Journal of Electronic Packaging, vol. 132, no.
2, paper No.021005, 2010, 8p.
[45] S. Kalahasti, and Y. Joshi, "Performance Characterization of a Novel
Flat Plate Micro Heat Pipe Spreader," IEEE Transactions on
Components and Packaging Technologies, vol. 25, no. 4, 2002, pp.
554-560.
[46] S.W. Kang, S.H. Tsai, and H.C. Chen, "Fabrication and Test of Radial
Grooved Micro Heat Pipes," Applied Thermal Engineering, vol. 22, no.
14, 2002, pp. 1559-1568.
[47] S.W. Kang, and D. Huang, "Fabrication of Star Grooves and Rhombus
Grooves Micro Heat Pipe," Journal of Micromechanics and
Microengineering, vol. 12, 2002, pp. 525-531.
[48] J.A. Kang, X. Fu, W.T. Liu, and P. Dario, "Investigation on Microheat
Pipe Array with Arteries," Journal of Thermophysics and Heat
Transfer, vol. 24, no. 4, 2010, pp. 803-810.
[49] C. Perret, Y. Avenas, Ch. Gillot, J. Boussey, and C. Schaeffer,
"Integrated Cooling Devices in Silicon Technology," The European
Physical Journal Applied Physics, vol. 18, no. 2, 2002, pp. 115-123
[50] M. Ivanova, A. Laï, C. Gillot, N. Sillon, C. Schaeffer, F. Lefèvre, M.
Lallemand, and E. Fournier, "Design, Fabrication and Test of Silicon
Heat Pipes With Radial Microcapillary Grooves," 10th Intersociety
Conference on Thermal and Thermomechanical Phenomena in
Electronic Systems (ITHERM 2006), vol. 1-2, San Diago, USA, 30 May
- 2 June, 2006, pp. 545-551.
[51] S. Murthy, Y. Joshi & W. Nakayama, "Orientation Independent Twophase
Heat Spreaders for Space Constrained Applications,"
Microelectronics Journal, vol. 34, 2003, pp. 1187-1193.
[52] S. Murthy, Y. Joshi, and W. Nakayama, "Two-phase Heat Spreaders
Utilizing Microfabricated Boiling Enhancement Structures," Heat
Transfer Engineering, vol. 25, no. 1, 2004, pp. 25-36.
[53] R. Hopkins, A. Faghri, and D. Khrustalev, "Flat Miniature Heat Pipes
with Micro Capillary Grooves," Journal of Heat Transfer, vol. 121,
1999, pp. 102-109.
[54] Y. Cao, M. Gao, J.E. Beam, and B. Donovan, "Experiments and
Analyses of Flat Miniature Heat Pipes," Journal of Thermophysics and
Heat Transfer, vol. 11, no. 2, 1997, pp. 158-164.
[55] Y. Cao, and M. Gao, "Wickless Network Heat Pipes for High Heat Flux
Spreading Applications," International Journal of Heat and Mass
Transfer, vol.45, 2002, pp. 2539-2547.
[56] L. Lin, R. Ponnappan, and J. Leland, "High Performance Miniature Heat
Pipe," International Journal of Heat and Mass Transfer, vol. 45, 2002,
pp. 3131-3142.
[57] M. Gao, and Y. Cao, "Flat and U-shaped Heat Spreaders for High-
Power Electronics," Heat Transfer Engineering, vol. 24, 2003, pp. 57-
65.
[58] J.C. Lin, J.C. Wu, C.T. Yeh, and C.Y. Yang, C.Y., "Fabrication and
Performance Analysis of Metallic Micro Heat Spreader for CPU," 13th
International Heat Pipe Conference, Shangai, China, September 21-25,
2004, pp. 151-155.
[59] M.C. Zaghdoudi, C. Tantolin, C. Godet, "Experimental and Theoretical
Analysis of Enhanced Flat Miniature Heat Pipes," Journal of
Thermophysics and Heat Transfer, vol. 18, no. 4, 2004, pp. 430-447.
[60] F. Lefèvre, R. Rullière, G. Pandraud, and M. Lallemand, "Prediction of
the Maximum Heat Transfer Capability of Two-Phase Heat Spreaders-
Experimental Validation," International Journal of Heat and Mass
Transfer, vol. 51, no. 15-16, 2008, pp. 4083-4094.
[61] S.H. Moon, G. Hwang, S.C. Ko, and Y.T. Kim, "Operating Performance
of Micro Heat Pipe for Thin Electronic Packaging," 7th International
Heat Pipe Symposium, Jeju Island, South Korea, October 12-16, 2003,
pp. 109-114.
[62] S.H. Moon, G. Hwang, S.C. Ko, & Y.T. Kim, "Experimental Study on
the Thermal Performance of Micro-Heat Pipe with Cross-section of
Polygon," Microelectronics Reliability, vol. 44, 2004, pp. 315-321.
[63] C. Romestant, G. Burban, and A. Alexandre, "Heat Pipe Application in
Thermal-Engine Car Air Conditioning," 13th International Heat Pipe
Conference, Shanghai, China, September 21-25, 2004, pp. 196-201.
[64] W. Xiaowu, T. Yong, and C. Ping, "Investigation into Performance of a
Heat Pipe with Micro Grooves Fabricated by Extrusion-Ploughing
Process," Energy Conversion and Management, vol. 50, 2009, pp.
1384-1388.
[65] M. Schneider, M. Yoshida, and M. Groll, M., "Investigation of
Interconnected Mini Heat Pipe Arrays For Micro Electronics Cooling,"
11th International Heat Pipe conference, Musachinoshi-Tokyo, Japan,
September 12-16, 1999, 6p.
[66] M. Schneider, M. Yoshida, and M. Groll, "Optical Investigation of Mini
Heat Pipe Arrays With Sharp Angled Triangular Grooves," Advances in
Electronic Packaging, EEP-Vol. 26-1 and 26-2, 1999, pp. 1965-1969.
[67] M. Schneider, M. Yoshida, and M. Groll, "Cooling of Electronic
Components By Mini Heat Pipe Arrays," 15th National Heat and Mass
transfer Conference and 4th ISHMT/ASME Heat and Mass Transfer
Conference, Pune, India, January 12-14, 2000, 8p.
[68] H.T. Chien, D.S. Lee, P.P. Ding, S.L. Chiu, and P.H. Chen, "Diskshaped
Miniature Heat Pipe (DMHP) with Radiating Micro Grooves for
a TO Can Laser Diode Package," IEEE Transactions on Components
and Packaging Technologies, vol. 26, no. 3, 2003, pp. 569-574.
[69] H.Z. Tao, H. Zhang, J. Zhuang, and J.W. Bowmans, "Experimental
Study of Partially Flattened Axial Grooved Heat Pipes," Applied
Thermal Engineering, vol. 28, 2008, pp. 1699-1710.
[70] H.T. Lim, S.H. Kim, H.D. Im, K.H. Oh, and S.H. Jeong, "Fabrication
and Evaluation of a Copper Flat Micro Heat Pipe Working under
Adverse-Gravity Orientation," Journal of Micromechanical
Microengineering, vol. 18, 2008, 8p.
[71] M. Murakami, T. Ogushi, Y. Sakurai, H. Masumuto, M. Furukawa, and
R. Imai, "Heat Pipe Heat Sink," 6th International Heat Pipe Conference,
Grenoble, France, May 25-29, 1987, pp. 257-261.
[72] D. Plesh, W. Bier, and D. Seidel, "Miniature Heat Pipes for Heat
Removal from Microelectronic Circuits," Micromechanical Sensors,
Actuators and Systems, vol. 32, 1991, pp. 303-313.
[73] J.Y. Sun, and C.Y. Wang, "The Development of Flat Heat Pipes for
Electronic Cooling," 4th International Heat Pipe Symposium, Tsukuba,
Japan, May 16-18, 1994, pp. 99-105.
[74] T. Ogushi, and G. Yamanaka, "Heat Transport Capability of Grooves
Heat Pipes," 5th International Heat Pipe Conference, pp. 74-79,
Tsukuba, Japan, May 14-18, 1994, pp. 74-79.
[75] P. Soo Yong, and B. Joon Hong, "Thermal Performance of a Grooved
Flat-Strip Heat Pipe with Multiple Source Locations," 7th International
Heat Pipe Symposium, Jeju Island, South Korea, October 12-16, 2003,
pp. 157-162.
[76] L. Zhang, T. Ma, Z.F. Zhang, and X. Ge, "Experimental Investigation on
Thermal Performance of Flat Miniature Heat Pipes with Axial Grooves,"
13th International Heat Pipe Conference, Shangai, China, September
21-25, 2004, pp. 206-210.
[77] N. Popova, C. Schaeffer, C. Sarno, S. Parbaud, and G. Kapelski, G.,
"Thermal management for stacked 3D microelectronic packages," 36th
Annual IEEE Power Electronic Specialists Conference (PESC 2005),
Recife, Brazil, June 12-16, 2005, pp. 1761-1766.
[78] N. Popova, C. Schaeffer, Y. Avenas, G. Kapelski, "Fabrication and
Experimental Investigation of Innovative Sintered Very Thin Copper
Heat Pipes for Electronics Applications, 37th IEEE Power Electronics
Specialists Conference (PESC 2006), vol. 1-7, Cheju Island, South
Korea, June 18-22, 2006, pp. 1652-1656.
[79] M. Zhang, Z. Liu, & G. Ma, "The experimental and numerical
investigation of a grooved vapo chamber," Applied Thermal
Engineering, vol. 29, 2009, pp. 422-430.
[80] M.C. Zaghdoudi, & C. Sarno, "Investigation on The Effects of Body
Force Environment on Flat Heat Pipes," Journal of Thermophysics and
Heat Transfer, vol. 15, no. 4, 2001, pp. 384-394.
[81] A. Faghri, Heat pipe science and technology (1st edition), Taylor &
Francis, ISBN 1-56032-383-3, United States of America, 1995.
[82] G.P. Peterson, An introduction to heat pipes - Modelling, testing and
applications (1st edition), John Wiley, United Stated of America, ISBM
0-471-30512-X, 1994.
[83] A.B. Duncan, and G.P. Peterson, "Charge Optimization for a
Triangular-Shaped Etched Micro Heat Pipe," Journal of Thermophysics,
vol. 9, no. 2, 1994, pp. 365-368.
[84] D. Khrustlev, A. Faghri, "Thermal Analysis of a Micro Heat Pipe,"
Journal of Heat Transfer, vol. 116, 1994, pp. 189-198.
[85] J.P. Longtin, B. Badran, and F.M. Gerner, "A one-dimensional model of
a micro heat pipe during steady-state operation," Journal of Heat
Transfer, vol. 116, 1994, pp. 709-715.
[86] G.P. Peterson, and H.B. Ma, "Theoretical Analysis of the Maximum
Heat Transport in Triangular Grooves: a Study of Idealized Micro Heat
Pipes, Journal of Heat Transfer, vol. 118, 1996, pp. 731-739.
[87] M.C. Zaghdoudi, V. Sartre, M. Lallemand, M., "Theoretical
Investigation of Micro Heat Pipes," 10th International Heat Pipe
Conference, Stuttgart, Germany, September 22-26, 1997, 6p.
[88] J.M. Ha, and G.P. Peterson, "The Heat Transport Capacity of Micro
Heat Pipes," Journal of Heat Transfer, vol. 120, 1998, pp. 1064-1071.
[89] H.B. Ma, & G.P. Peterson, G.P., "The Minimum Meniscus Radius and
Capillary Heat Transport Limit in Micro Heat Pipes," Journal of Heat
Transfer, vol. 120, 1998, pp. 227-233.
[90] C.B. Sobhan, H. Xiaoy Ang, and L.C. Yu, "Investigations on transient
and steady-state performance of a micro heat pipe," Journal of
Thermophysics and Heat Transfer, vol. 14, no. 1, 2000, pp. 161-169.
[91] K.H. Do, S.J. Kim, and J.K. Seo, "Mathematical Modeling and Thermal
Optimization of a Micro Heat Pipe with Curved Triangular Grooves,"
7th International Heat Pipe Symposium, Jeju Island, South Korea,
October 12-16, 2003, pp.325-331.
[92] B. Suman, S. De, and S. DasGupta, "A Model of the Capillary Limit of
a Micro Heat Pipe and Prediction of the Dry-out Length," International
Journal of Heat and Fluid Flow, vol. 26, 2005, pp. 495-505.
[93] B. Suman, and P. Kumar, "An Analytical Model for Fluid Flow and
Heat Transfer in a Micro-Heat Pipe of Polygonal Shape," International
Journal of Heat and Mass Transfer, Vol.48, 2005, pp. 4498-4509.
[94] Y.M. Hung, and Q. Seng, "Effects of Geometric Design on Thermal
Performance of Star-groove Micro-Heat Pipes," International Journal of
Heat and Mass Transfer, vol. 54, 2011, pp. 1198-1209.
[95] P.C. Wayner, Y.K. Kao, and L.V. Lacroix, "The Interline Heat Transfer
Coefficient of an Evaporating Wetting Film," International Journal of
Heat and Mass Transfer, vol.19, no.2, 1976, pp. 487-492.
[96] Y. Kamotani, Y., "Evaporator Film Coefficients of Grooved Heat
Pipes," 3rd International Heat Pipe Conference, Palo Alto, California,
USA, September 22-24, 1978, 3p.
[97] F.W. Holm, and S.P. Goplen, "Heat Transfer in the Meniscus Thin Film
Transition Region," Journal of Heat Transfer, vol. 101, 1979, pp. 543-
547.
[98] P.C. Stephan, C.A. B├╝sse, "Analysis of the Heat Transfer Coefficient of
Grooved Heat Pipe Evaporator Walls," International Journal of Heat
and Mass Transfer, vol. 35, no. 2, 1992, pp. 383-391.
[99] L.W. Swanson, and G.P. Peterson, "Evaporating Extended Meniscus in
a V-shaped Channel," Journal of Thermophysics and Heat Transfer,
vol. 8, no. 1, 1994, pp. 172-180.
[100]D. Khrustlev, and A. Faghri, "Thermal Characteristics of Conventional
and Flat Miniature Axially Grooved Heat Pipes," Journal of Heat
Transfer, vol. 117, 1995, pp. 1048-1054.
[101]H.B. Ma, and G.P. Peterson, Temperature Variation and Heat Transfer
in Triangular Grooves with an Evaporating Film, Journal of
Thermophysics and Heat Transfer, vol. 11, no.1, 1997, pp. 90-97.
[102]A. Faghri, and D. Khrustalev, "Advances in modeling of enhanced flat
miniature heat pipes with capillary grooves," Journal of Enhanced Heat
Transfer, vol. 4, no. 2, 1997, pp. 99-109.
[103]D. Khrustlev, and A. Faghri, A., "Coupled Liquid and Vapor Flow in
Miniature Passages with Micro Grooves," Journal of Heat Transfer, vol.
121, 1999, pp. 729-733.
[104]F. Lefèvre, R. Revellin, and M. Lallemand, "Theoretical Analysis of
Two-Phase Heat Spreaders with Different Cross-section Micro
Grooves," 7th International Heat Pipe Symposium, Jeju Island, South
Korea, October 12-16, 2003, pp. 97-102.
[105]S. Launay, V. Sartre, and M. Lallemand, "Hydrodynamic and Thermal
Study of a Water-Filled Micro Heat Pipe Array," Journal of
Thermophysics and Heat Transfer, vol. 18, no. 3, 2004, pp. 358-363.
[106]S. Tzanova, M. Ivanova, Y. Avenas, and C. Schaeffer, "Analytical
Investigation of Flat Silicon Micro Heat Spreaders," Industry
Applications Conference, 39th IAS Annual Meeting Conference Record
of the 2004 IEEE, vol. 4, October 3-7, 2004, pp. 2296-2302.
[107]G. Angelov, S. Tzanova, Y. Avenas, M. Ivanova, T. Takov, C.
Schaeffer, and L. Kamenova, "Modeling of Heat Spreaders for Cooling
Power and Mobile Electronic Devices," 36th Power Electronics
Specialists Conference (PESC 2005), Recife, Brazil, June 12-15, 2005,
pp. 1080-1086.
[108]P.Z. Shi, K.M. Chua, S.C.K. Wong, and Y.M. Tan, "Design and
Performance Optimization of Miniature Heat Pipe in LTCC," Journal of
Physics: Conference Series, vol. 34, 2006, pp. 142-147.
[109]K.H. Do, S.J. Kim, and S.V. Garimella, "A Mathematical Model for
Analyzing the Thermal Characteristics of a Flat Micro Heat Pipe with a
Grooved Wick," International Journal Heat and Mass Transfer, vol.51,
no.19-20, 2008, pp. 4637-4650.
[110]K.H. Do, and S.P. Jang, "Effect of Nanofluids on the Thermal
Performance of a Flat Micro Heat Pipe with a Rectangular Grooved
Wick," International Journal of Heat and Mass Transfer, vol.53, 2010,
pp. 2183-2192.
[111]Y. Wang, and K. Vafai, "Transient Characterization of Flat Plate Heat
Pipes During Startup and Shutdown operations," International journal
of Heat and Mass Transfer, vol. 43, 2000, pp. 2641-2655.
[112]U. Vadakkan, J.Y. Murthy, S.V. Garimella, "Transport in Flat Heat
Pipes at High Fluxes from Multiple Discrete Sources," Journal of Heat
Transfer, vol. 126, 2004, pp. 347-354.
[113]L. Kamenova, Y. Avenas, S. Tzanova, N. Popova, and C. Schaeffer, "2D
Numerical Modeling of the Thermal and Hydraulic Performances of a
Very Thin Sintered Powder Copper Flat Heat pipe," 37th IEEE Power
Electronics Specialist Conference (PESC 2006), Cheju Island, South
Korea, June 18-22, 2006, pp. 1130-1136.
[114]F. Lefèvre, and M. Lallemand, "Coupled Thermal Hydrodnamic Models
of Flat Micro Heat Pipes for Cooling of Multiple Electronic
Components," International Journal of Heat and Mass Transfer, vol.
49, 2006, pp. 1375-1383.
[115]Y. Koito, H. Imura, M. Mochizuki, Y. Saito, & S. Torii, "Numerical
Analysis and Experimental Verification on Thermal Fluid Phenomena in
a Vapor Chamber," Applied Thermal Engineering, vol. 26, 2006, pp.
1669-1676.
[116]M.S. El-Genk, H.H. Saber, and J.L. Parker, "Efficient Spreaders for
Cooling High-Power Computer Chips," Applied Thermal Engineering,
vol. 27, 2007, pp. 1072-1088.
[117]R. Sonan, S. Harmand, J. Pelle, D. Leger, and M. Fakes, "Transient
Thermal and hydrodynamic Model of Flat Heat Pipe for the Cooling of
Electronics Components," International Journal of Heat and Mass
transfer, vol. 51, no. 25-26, 2008, pp. 6006-6017.
[118]B. Xiao, & A. Faghri, "A Three-Dimensional Thermal-Fluid Analysis of
Flat Heat Pipes," International Journal Heat and Mass Transfer,
Vol.51, 2008, pp. 3113-3126.
[119]R. Ranjan, J.Y. Murthy, S.V. Garimella, and U. Vadakkan, "A
Numerical Model for Transport in Flat Heat Pipes Considering Wick
Microstructure Effects," International Journal of Heat and Mass
Transfer, vol. 54, 2011, pp. 153-168.
[1] M. Groll, M. Schneider, V. Sartre, M.C. Zaghdoudi, and M. Lallemand,
"Thermal Control of electronic equipment by heat pipes," Revue
Générale de Thermique, vol. 37, no. 5, 1998, pp. 323-352.
[2] T.P. Cotter, "Principles and Prospects of Micro Heat Pipes," 5th
International Heat Pipe Conference, Tsukuba, Japan, May 14-18, 1984,
pp. 328-335.
[3] A. Itoh, and F. Polasek, "Development and Application of Micro Heat
pipes," 7th International Heat Pipe Conference, Minsk, Russia, May 21-
25, 1990.
[4] Z. Ji, W. Caiyou, Y. Xiuqin, and Z. Zeqing, "Experimental Investigation
of the Heat Transfer Characteristics of the Micro Heat Pipes," 8th
International Heat Pipe Conference, Bejing, China, September 14-18,
1992, pp. 416-420.
[5] B.R. Babin, G.P. Peterson, and D. Wu, "Analysis and Testing of a
Micro Heat Pipe During Steady-State," ASME/AIchE National Heat
Transfer Conference, Paper No. 89-HT-17, Philadelphia, Pennsyvania,
USA, August 5-8, 1989, 10p.
[6] B.R. Babin, G.P. Peterson, and D. Wu, "Steady-State Modeling and
Testing of Micro Heat Pipe," Journal of Heat Transfer, vol. 112, 1990,
pp. 595-601.
[7] D. Wu, and G.P. Peterson, "Investigation of the Transient
Characteristics of a Micro Heat Pipe," Journal of Thermophysics and
Heat Transfer, vol. 5, no. 2, 1991, pp. 129-134.
[8] D. Wu, G.P. Peterson, and W.S. Chang, "Transient Experimental
Investigation of Micro Heat pipes," Journal of Thermophysics and Heat
Transfer, vol. 5, no. 4, 1991, pp. 539-545.
[9] S.H. Moon, C.J. Kim, B.H. Kim, S.E. Hong, and J.S. Lee, "An
Experimental Study on the Performance Limitation of a Micro Heat Pipe
with Triangular Cross-Section," 10th International Heat Pipe
Conference, Tokyo, Japan, September 22-26, 1999, pp. 15-19.
[10] G.P. Peterson, "Heat Pipes in the Thermal Control of Electronic
Components," 3rd International Heat Pipe Symposium, September 12-
14, Tsukuba, Japan, 1988, pp. 2-12.
[11] G.P. Peterson, A.B. Duncan, A.S. Ahmed, A.K. Mallik, and M.H.
Weichold, "Experimental Investigation of Micro Heat Pipes in Silicon
Wafers," Micromechanical Sensors, Actuators, and Systems, DSC-Vol.
32, 1991, pp. 341-348.
[12] F.M. Gerner, "Micro Heat Pipes," AFSOR Final Report, No.S-210-
10MG-066, Wright-Patterson AFB, Dayton, OH, USA, 1990.
[13] A.K. Mallik, and G.P. Peterson, "On the Use of Micro Heat Pipes as an
Integral Part of Semiconductors," 3rd ASME-JSME Thermal
Engineering Joint Conference Proceeding, vol. 2, Reno, NV, USA,
March 17-22, 1991, pp. 394-401.
[14] F.M. Gerner, B. Badran, J.P. Longtin, P. Ramadas, T.H. Henderson, and
W.S. Chang, "Flow and Heat Transfer Limitations in Micro Heat Pipes,"
28th National Heat Transfer Conference, August 9-12, San Diego, CA,
USA, 1992, pp. 99-104.
[15] G.P. Peterson, A.B. Duncan, and M.H. Weichold, "Experimental
Investigation of Micro Heat Pipes Fabricated in Silicon Wafers,"
Journal of Heat Transfer, vol. 115, 1993, pp. 751-756.
[16] F.M. Gerner, B. Badran, H.T. Henderson, and P. Ramadas, "Silicon-
Water Micro Heat Pipes," Thermal Science Engineering, vol. 2, no.1,
1994, pp. 90-97.
[17] D. Shen, R. Mitchell, D. Dobranich, D. Adkins, and M. Tuck, "Micro
Heat Spreader Enhanced Heat Transfer in MCMs," IEEE Multi-Chip-
Module Conference, Santa Cruz, California, USA, January 31-February
2, 1995, pp. 189-194.
[18] D.A. Benson, D.R. Adkins, G.P. Peterson, R.T. Mitchell, M.R. Tuck,
and D.W. Palmer, "Turning Silicon Substrates into Diamond: Micro
Machining Heat Pipes," Advances in Design, Materials and Processes
for Thermal Spreaders and Heat Sinks Workshop, Vail, CO, USA, April
19-21, 1996, pp. 19-21.
[19] D.A. Benson, D.R. Adkins, G.P. Peterson, R.T. Mitchell, M.R. Tuck,
and D.W. Palmer, "Micro Machined Heat Pipes in Silicon MCM
Substrates," Proceeding of IEEE Multichip Module Conference, Santa
Cruz, CA, USA, November 6-7, 1996, pp. 127-129.
[20] D.A. Benson, R.T. Mitchell, M.R. Tuck, D.W. Palmer, and G.P.
Peterson, "Ultrahigh-Capacity Micromachined Heat Spreaders,"
Microscale Thermophysical Engineering, vol. 2, no.1, 1998, pp. 21-30.
[21] B. Badran, F.M. Gerner, P. Ramadas, T. Henderson, and K.W. Baker,
"Experimental Results for Low-temperature Silicon Micromachined
Micro Heat Pipe Arrays Using Water and Methanol as Working Fluids,"
Experimental Heat Transfer, vol. 10, no. 4, 1997, pp. 253-272.
[22] B. Gromoll, "Micro cooling systems for high density packaging," Revue
Générale de la Thermique, vol. 37, 1998, pp. 781-787.
[23] Y. Avenas, B. Mallet, C. Gillot, A. Bricard, C. Schaeffer, G. Poupon,
and E. Fournier, "Thermal Spreaders for High Heat Flux Power
Devices," 7th THERMINIC Workshop, Paris, France, September 24-27,
2001, pp. 59-631.
[24] Y. Avenas, M. Ivanova, N. Popova, C. Schaeffer, J.L. Schanen, and A.
Bricard, "Thermal Analysis of Thermal Spreaders Used in Power
Electronics Cooling," 37th Annual Meeting of the Industry-Applications-
Society, Conference Record of the 2002 IEEE Industry Applications
Conference, Pittsburgh, PA, USA, October 12-18, 2002, pp. 216-221.
[25] C. Gillot, Y. Avenas, N. Cezac, G. Poupon, C. Schaeffer, and E.
Fournier, "Silicon Heat Pipes Used as Thermal Spreaders," 8th
Intersociety Conference on Thermal and Thermomechanical
Phenomena in Electronic Systems (ITHERM 2002), San Diego, USA,
May 30- June 01, 2002, pp. 1052-1057.
[26] C. Gillot, Y. Avenas, N. Cezac, G. Poupon, C. Schaeffer, and E.
Fournier, "Silicon Heat Pipes Used as Thermal Spreaders," IEEE
Transactions on Components and Packaging Technologies, vol. 26, no.
2, 2003, pp. 332-339.
[27] C. Gillot, G. Poupon, Y. Avenas, C. Schaeffer, and E. Fournier, E.,
"Design and Fabrication of Flat Silicon Heat Pipes with Micro Capillary
Grooves," Houille Blanche-Revue Internationale de l-Eau, no. 4, 2003,
pp. 62-66.
[28] C. Gillot, A. Laï, M. Ivanova, Y. Avenas, C. Schaeffer, and E. Fournier,
"Experimental Study of a Flat Silicon Heat Pipe with Microcapillary
Grooves," 9th Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems (ITHERM 2004),
vol. 2, Las Vegas, NV, USA, June 1-4, 2004, pp. 47-51.
[29] M. Ivanova, C. Schaeffer, Y. Avenas, A. Laï, and C. Gillot, "Realization
and Thermal Analysis of Silicon Thermal Spreaders used in power
electronics cooling," IEEE International Conference on Industrial
Technology, vol. 1-2, Maribor, Slovenia, December 10-12, 2003 pp.
1124-1129.
[30] M. Lee, M. Wong, and Y. Zohar, "Characterization of an Integrated
Micro Heat pipe," Journal of Micromechanics and Microengineering,
Vol.13, 2003, pp. 58-64.
[31] M. Lee, M. Wong, and Y. Zohar, "Integrated Micro Heat Pipe
Fabrication Technology," Journal of Microelectromechanical Systems,
vol. 12, no. 2, 2003, pp. 138-146.
[32] A. Laï, C. Gillot, M. Ivanova, Y. Avenas, C. Louis, C. Schaeffer, and E.
Fournier, "Thermal Characterization of Flat Silicon Heat Pipes," 20th
Annual IEEE Semiconductor Thermal Measurement and Management
Symposium, San Jose, CA, USA, 9-11 March, 2004, pp. 21-25.
[33] A.K. Mallik, G.P. Peterson, and W. Weichold, "Construction Processes
for Vapor Deposited Micro Heat Pipes," 10th Symposium on Electronic
Materials Processing and Characteristics, Richardson, TX, USA, June
3-4, 1991.
[34] A.K. Mallik, G.P. Peterson, and M.H. Weichold, "On the Use of Micro
Heat Pipes as an Integral Part of Semiconductor Devices," Journal of
Electronic Packaging, vol. 114, 1992, pp. 436-442.
[35] M.H. Weichold, G.P. Peterson, and A. Mallik, "Vapor Deposited Micro
Heat Pipes," U.S. Patent 5,179,043, 1993.
[36] G.P. Peterson, and A.K. Mallik, "Steady-State Investigation of Vapor
Deposited Micro Heat Pipe Arrays," Journal of Electronic Packaging,
vol. 117, no. 1, 1995, pp. 75-81.
[37] G.P. Peterson, and A.K. Mallik, "Transient Response of Vapor
Deposited Micro Heat Pipe Arrays," Journal of Electronic Packaging,
vol. 117, no. 1, 1995, pp. 82-87.
[38] D.R. Adkins, D.S. Shen, D.W. Palmer, and M.R. Tuck, "Silicon Heat
Pipes for Cooling Electronics," Proceeding of 1st Annual Spacecraft
Thermal Control Symposium, Albuquerque, NM, USA, November 16-
18, 1994, 11p.
[39] M. Le Berre, S. Launay, V. Sartre, and M. Lallemand, "Fabrication and
Experimental Investigation of Silicon Micro Heat Pipes for Cooling
Electronics," Journal of Micromechanics and Microengineering, vol.
13, no. 3, 2003, pp. 436-441.
[40] S. Launay, M. Le Berre, V. Sartre, P. Morfouli, J. Boussey, D. Barbier,
and M. Lallemand, "Fabrication of Silicon Micro Heat Pipes for Cooling
Electronics," Houille Blanche-Revue Internationale de l-Eau, no. 4,
2003, pp. 82-87.
[41] S. Launay, V. Sartre, and M. Lallemand, "Experimental Study on
Silicon Micro Heat Pipe Arrays," Applied Thermal Engineering, vol.
24, 2004, pp. 233-243.
[42] M. Le Berre, G. Pandraud, and P. Morfouli, "The performance of Micro
Heat Pipes Measured by Integrated Sensors," Journal of
Micromechanical Microengineering, vol. 16, no. 5, 2006, pp. 1047-
1050.
[43] G. Pandraud, M. Le Berre, P. Morfouli, and M. Lallemand, "Influence of
the fluid on the experimental performances of triangular silicon micro
heat pipes," Journal of Electronic Packaging, vol. 128, no. 3, 2006, pp.
294-296.
[44] D.K. Harris, A. Palkar, G. Woncott, R. Dean, and F. Simionescu, "An
Experimental Investigation in the Performance of Water-filled Silicon
Microheat Pipe Arrays," Journal of Electronic Packaging, vol. 132, no.
2, paper No.021005, 2010, 8p.
[45] S. Kalahasti, and Y. Joshi, "Performance Characterization of a Novel
Flat Plate Micro Heat Pipe Spreader," IEEE Transactions on
Components and Packaging Technologies, vol. 25, no. 4, 2002, pp.
554-560.
[46] S.W. Kang, S.H. Tsai, and H.C. Chen, "Fabrication and Test of Radial
Grooved Micro Heat Pipes," Applied Thermal Engineering, vol. 22, no.
14, 2002, pp. 1559-1568.
[47] S.W. Kang, and D. Huang, "Fabrication of Star Grooves and Rhombus
Grooves Micro Heat Pipe," Journal of Micromechanics and
Microengineering, vol. 12, 2002, pp. 525-531.
[48] J.A. Kang, X. Fu, W.T. Liu, and P. Dario, "Investigation on Microheat
Pipe Array with Arteries," Journal of Thermophysics and Heat
Transfer, vol. 24, no. 4, 2010, pp. 803-810.
[49] C. Perret, Y. Avenas, Ch. Gillot, J. Boussey, and C. Schaeffer,
"Integrated Cooling Devices in Silicon Technology," The European
Physical Journal Applied Physics, vol. 18, no. 2, 2002, pp. 115-123
[50] M. Ivanova, A. Laï, C. Gillot, N. Sillon, C. Schaeffer, F. Lefèvre, M.
Lallemand, and E. Fournier, "Design, Fabrication and Test of Silicon
Heat Pipes With Radial Microcapillary Grooves," 10th Intersociety
Conference on Thermal and Thermomechanical Phenomena in
Electronic Systems (ITHERM 2006), vol. 1-2, San Diago, USA, 30 May
- 2 June, 2006, pp. 545-551.
[51] S. Murthy, Y. Joshi & W. Nakayama, "Orientation Independent Twophase
Heat Spreaders for Space Constrained Applications,"
Microelectronics Journal, vol. 34, 2003, pp. 1187-1193.
[52] S. Murthy, Y. Joshi, and W. Nakayama, "Two-phase Heat Spreaders
Utilizing Microfabricated Boiling Enhancement Structures," Heat
Transfer Engineering, vol. 25, no. 1, 2004, pp. 25-36.
[53] R. Hopkins, A. Faghri, and D. Khrustalev, "Flat Miniature Heat Pipes
with Micro Capillary Grooves," Journal of Heat Transfer, vol. 121,
1999, pp. 102-109.
[54] Y. Cao, M. Gao, J.E. Beam, and B. Donovan, "Experiments and
Analyses of Flat Miniature Heat Pipes," Journal of Thermophysics and
Heat Transfer, vol. 11, no. 2, 1997, pp. 158-164.
[55] Y. Cao, and M. Gao, "Wickless Network Heat Pipes for High Heat Flux
Spreading Applications," International Journal of Heat and Mass
Transfer, vol.45, 2002, pp. 2539-2547.
[56] L. Lin, R. Ponnappan, and J. Leland, "High Performance Miniature Heat
Pipe," International Journal of Heat and Mass Transfer, vol. 45, 2002,
pp. 3131-3142.
[57] M. Gao, and Y. Cao, "Flat and U-shaped Heat Spreaders for High-
Power Electronics," Heat Transfer Engineering, vol. 24, 2003, pp. 57-
65.
[58] J.C. Lin, J.C. Wu, C.T. Yeh, and C.Y. Yang, C.Y., "Fabrication and
Performance Analysis of Metallic Micro Heat Spreader for CPU," 13th
International Heat Pipe Conference, Shangai, China, September 21-25,
2004, pp. 151-155.
[59] M.C. Zaghdoudi, C. Tantolin, C. Godet, "Experimental and Theoretical
Analysis of Enhanced Flat Miniature Heat Pipes," Journal of
Thermophysics and Heat Transfer, vol. 18, no. 4, 2004, pp. 430-447.
[60] F. Lefèvre, R. Rullière, G. Pandraud, and M. Lallemand, "Prediction of
the Maximum Heat Transfer Capability of Two-Phase Heat Spreaders-
Experimental Validation," International Journal of Heat and Mass
Transfer, vol. 51, no. 15-16, 2008, pp. 4083-4094.
[61] S.H. Moon, G. Hwang, S.C. Ko, and Y.T. Kim, "Operating Performance
of Micro Heat Pipe for Thin Electronic Packaging," 7th International
Heat Pipe Symposium, Jeju Island, South Korea, October 12-16, 2003,
pp. 109-114.
[62] S.H. Moon, G. Hwang, S.C. Ko, & Y.T. Kim, "Experimental Study on
the Thermal Performance of Micro-Heat Pipe with Cross-section of
Polygon," Microelectronics Reliability, vol. 44, 2004, pp. 315-321.
[63] C. Romestant, G. Burban, and A. Alexandre, "Heat Pipe Application in
Thermal-Engine Car Air Conditioning," 13th International Heat Pipe
Conference, Shanghai, China, September 21-25, 2004, pp. 196-201.
[64] W. Xiaowu, T. Yong, and C. Ping, "Investigation into Performance of a
Heat Pipe with Micro Grooves Fabricated by Extrusion-Ploughing
Process," Energy Conversion and Management, vol. 50, 2009, pp.
1384-1388.
[65] M. Schneider, M. Yoshida, and M. Groll, M., "Investigation of
Interconnected Mini Heat Pipe Arrays For Micro Electronics Cooling,"
11th International Heat Pipe conference, Musachinoshi-Tokyo, Japan,
September 12-16, 1999, 6p.
[66] M. Schneider, M. Yoshida, and M. Groll, "Optical Investigation of Mini
Heat Pipe Arrays With Sharp Angled Triangular Grooves," Advances in
Electronic Packaging, EEP-Vol. 26-1 and 26-2, 1999, pp. 1965-1969.
[67] M. Schneider, M. Yoshida, and M. Groll, "Cooling of Electronic
Components By Mini Heat Pipe Arrays," 15th National Heat and Mass
transfer Conference and 4th ISHMT/ASME Heat and Mass Transfer
Conference, Pune, India, January 12-14, 2000, 8p.
[68] H.T. Chien, D.S. Lee, P.P. Ding, S.L. Chiu, and P.H. Chen, "Diskshaped
Miniature Heat Pipe (DMHP) with Radiating Micro Grooves for
a TO Can Laser Diode Package," IEEE Transactions on Components
and Packaging Technologies, vol. 26, no. 3, 2003, pp. 569-574.
[69] H.Z. Tao, H. Zhang, J. Zhuang, and J.W. Bowmans, "Experimental
Study of Partially Flattened Axial Grooved Heat Pipes," Applied
Thermal Engineering, vol. 28, 2008, pp. 1699-1710.
[70] H.T. Lim, S.H. Kim, H.D. Im, K.H. Oh, and S.H. Jeong, "Fabrication
and Evaluation of a Copper Flat Micro Heat Pipe Working under
Adverse-Gravity Orientation," Journal of Micromechanical
Microengineering, vol. 18, 2008, 8p.
[71] M. Murakami, T. Ogushi, Y. Sakurai, H. Masumuto, M. Furukawa, and
R. Imai, "Heat Pipe Heat Sink," 6th International Heat Pipe Conference,
Grenoble, France, May 25-29, 1987, pp. 257-261.
[72] D. Plesh, W. Bier, and D. Seidel, "Miniature Heat Pipes for Heat
Removal from Microelectronic Circuits," Micromechanical Sensors,
Actuators and Systems, vol. 32, 1991, pp. 303-313.
[73] J.Y. Sun, and C.Y. Wang, "The Development of Flat Heat Pipes for
Electronic Cooling," 4th International Heat Pipe Symposium, Tsukuba,
Japan, May 16-18, 1994, pp. 99-105.
[74] T. Ogushi, and G. Yamanaka, "Heat Transport Capability of Grooves
Heat Pipes," 5th International Heat Pipe Conference, pp. 74-79,
Tsukuba, Japan, May 14-18, 1994, pp. 74-79.
[75] P. Soo Yong, and B. Joon Hong, "Thermal Performance of a Grooved
Flat-Strip Heat Pipe with Multiple Source Locations," 7th International
Heat Pipe Symposium, Jeju Island, South Korea, October 12-16, 2003,
pp. 157-162.
[76] L. Zhang, T. Ma, Z.F. Zhang, and X. Ge, "Experimental Investigation on
Thermal Performance of Flat Miniature Heat Pipes with Axial Grooves,"
13th International Heat Pipe Conference, Shangai, China, September
21-25, 2004, pp. 206-210.
[77] N. Popova, C. Schaeffer, C. Sarno, S. Parbaud, and G. Kapelski, G.,
"Thermal management for stacked 3D microelectronic packages," 36th
Annual IEEE Power Electronic Specialists Conference (PESC 2005),
Recife, Brazil, June 12-16, 2005, pp. 1761-1766.
[78] N. Popova, C. Schaeffer, Y. Avenas, G. Kapelski, "Fabrication and
Experimental Investigation of Innovative Sintered Very Thin Copper
Heat Pipes for Electronics Applications, 37th IEEE Power Electronics
Specialists Conference (PESC 2006), vol. 1-7, Cheju Island, South
Korea, June 18-22, 2006, pp. 1652-1656.
[79] M. Zhang, Z. Liu, & G. Ma, "The experimental and numerical
investigation of a grooved vapo chamber," Applied Thermal
Engineering, vol. 29, 2009, pp. 422-430.
[80] M.C. Zaghdoudi, & C. Sarno, "Investigation on The Effects of Body
Force Environment on Flat Heat Pipes," Journal of Thermophysics and
Heat Transfer, vol. 15, no. 4, 2001, pp. 384-394.
[81] A. Faghri, Heat pipe science and technology (1st edition), Taylor &
Francis, ISBN 1-56032-383-3, United States of America, 1995.
[82] G.P. Peterson, An introduction to heat pipes - Modelling, testing and
applications (1st edition), John Wiley, United Stated of America, ISBM
0-471-30512-X, 1994.
[83] A.B. Duncan, and G.P. Peterson, "Charge Optimization for a
Triangular-Shaped Etched Micro Heat Pipe," Journal of Thermophysics,
vol. 9, no. 2, 1994, pp. 365-368.
[84] D. Khrustlev, A. Faghri, "Thermal Analysis of a Micro Heat Pipe,"
Journal of Heat Transfer, vol. 116, 1994, pp. 189-198.
[85] J.P. Longtin, B. Badran, and F.M. Gerner, "A one-dimensional model of
a micro heat pipe during steady-state operation," Journal of Heat
Transfer, vol. 116, 1994, pp. 709-715.
[86] G.P. Peterson, and H.B. Ma, "Theoretical Analysis of the Maximum
Heat Transport in Triangular Grooves: a Study of Idealized Micro Heat
Pipes, Journal of Heat Transfer, vol. 118, 1996, pp. 731-739.
[87] M.C. Zaghdoudi, V. Sartre, M. Lallemand, M., "Theoretical
Investigation of Micro Heat Pipes," 10th International Heat Pipe
Conference, Stuttgart, Germany, September 22-26, 1997, 6p.
[88] J.M. Ha, and G.P. Peterson, "The Heat Transport Capacity of Micro
Heat Pipes," Journal of Heat Transfer, vol. 120, 1998, pp. 1064-1071.
[89] H.B. Ma, & G.P. Peterson, G.P., "The Minimum Meniscus Radius and
Capillary Heat Transport Limit in Micro Heat Pipes," Journal of Heat
Transfer, vol. 120, 1998, pp. 227-233.
[90] C.B. Sobhan, H. Xiaoy Ang, and L.C. Yu, "Investigations on transient
and steady-state performance of a micro heat pipe," Journal of
Thermophysics and Heat Transfer, vol. 14, no. 1, 2000, pp. 161-169.
[91] K.H. Do, S.J. Kim, and J.K. Seo, "Mathematical Modeling and Thermal
Optimization of a Micro Heat Pipe with Curved Triangular Grooves,"
7th International Heat Pipe Symposium, Jeju Island, South Korea,
October 12-16, 2003, pp.325-331.
[92] B. Suman, S. De, and S. DasGupta, "A Model of the Capillary Limit of
a Micro Heat Pipe and Prediction of the Dry-out Length," International
Journal of Heat and Fluid Flow, vol. 26, 2005, pp. 495-505.
[93] B. Suman, and P. Kumar, "An Analytical Model for Fluid Flow and
Heat Transfer in a Micro-Heat Pipe of Polygonal Shape," International
Journal of Heat and Mass Transfer, Vol.48, 2005, pp. 4498-4509.
[94] Y.M. Hung, and Q. Seng, "Effects of Geometric Design on Thermal
Performance of Star-groove Micro-Heat Pipes," International Journal of
Heat and Mass Transfer, vol. 54, 2011, pp. 1198-1209.
[95] P.C. Wayner, Y.K. Kao, and L.V. Lacroix, "The Interline Heat Transfer
Coefficient of an Evaporating Wetting Film," International Journal of
Heat and Mass Transfer, vol.19, no.2, 1976, pp. 487-492.
[96] Y. Kamotani, Y., "Evaporator Film Coefficients of Grooved Heat
Pipes," 3rd International Heat Pipe Conference, Palo Alto, California,
USA, September 22-24, 1978, 3p.
[97] F.W. Holm, and S.P. Goplen, "Heat Transfer in the Meniscus Thin Film
Transition Region," Journal of Heat Transfer, vol. 101, 1979, pp. 543-
547.
[98] P.C. Stephan, C.A. B├╝sse, "Analysis of the Heat Transfer Coefficient of
Grooved Heat Pipe Evaporator Walls," International Journal of Heat
and Mass Transfer, vol. 35, no. 2, 1992, pp. 383-391.
[99] L.W. Swanson, and G.P. Peterson, "Evaporating Extended Meniscus in
a V-shaped Channel," Journal of Thermophysics and Heat Transfer,
vol. 8, no. 1, 1994, pp. 172-180.
[100]D. Khrustlev, and A. Faghri, "Thermal Characteristics of Conventional
and Flat Miniature Axially Grooved Heat Pipes," Journal of Heat
Transfer, vol. 117, 1995, pp. 1048-1054.
[101]H.B. Ma, and G.P. Peterson, Temperature Variation and Heat Transfer
in Triangular Grooves with an Evaporating Film, Journal of
Thermophysics and Heat Transfer, vol. 11, no.1, 1997, pp. 90-97.
[102]A. Faghri, and D. Khrustalev, "Advances in modeling of enhanced flat
miniature heat pipes with capillary grooves," Journal of Enhanced Heat
Transfer, vol. 4, no. 2, 1997, pp. 99-109.
[103]D. Khrustlev, and A. Faghri, A., "Coupled Liquid and Vapor Flow in
Miniature Passages with Micro Grooves," Journal of Heat Transfer, vol.
121, 1999, pp. 729-733.
[104]F. Lefèvre, R. Revellin, and M. Lallemand, "Theoretical Analysis of
Two-Phase Heat Spreaders with Different Cross-section Micro
Grooves," 7th International Heat Pipe Symposium, Jeju Island, South
Korea, October 12-16, 2003, pp. 97-102.
[105]S. Launay, V. Sartre, and M. Lallemand, "Hydrodynamic and Thermal
Study of a Water-Filled Micro Heat Pipe Array," Journal of
Thermophysics and Heat Transfer, vol. 18, no. 3, 2004, pp. 358-363.
[106]S. Tzanova, M. Ivanova, Y. Avenas, and C. Schaeffer, "Analytical
Investigation of Flat Silicon Micro Heat Spreaders," Industry
Applications Conference, 39th IAS Annual Meeting Conference Record
of the 2004 IEEE, vol. 4, October 3-7, 2004, pp. 2296-2302.
[107]G. Angelov, S. Tzanova, Y. Avenas, M. Ivanova, T. Takov, C.
Schaeffer, and L. Kamenova, "Modeling of Heat Spreaders for Cooling
Power and Mobile Electronic Devices," 36th Power Electronics
Specialists Conference (PESC 2005), Recife, Brazil, June 12-15, 2005,
pp. 1080-1086.
[108]P.Z. Shi, K.M. Chua, S.C.K. Wong, and Y.M. Tan, "Design and
Performance Optimization of Miniature Heat Pipe in LTCC," Journal of
Physics: Conference Series, vol. 34, 2006, pp. 142-147.
[109]K.H. Do, S.J. Kim, and S.V. Garimella, "A Mathematical Model for
Analyzing the Thermal Characteristics of a Flat Micro Heat Pipe with a
Grooved Wick," International Journal Heat and Mass Transfer, vol.51,
no.19-20, 2008, pp. 4637-4650.
[110]K.H. Do, and S.P. Jang, "Effect of Nanofluids on the Thermal
Performance of a Flat Micro Heat Pipe with a Rectangular Grooved
Wick," International Journal of Heat and Mass Transfer, vol.53, 2010,
pp. 2183-2192.
[111]Y. Wang, and K. Vafai, "Transient Characterization of Flat Plate Heat
Pipes During Startup and Shutdown operations," International journal
of Heat and Mass Transfer, vol. 43, 2000, pp. 2641-2655.
[112]U. Vadakkan, J.Y. Murthy, S.V. Garimella, "Transport in Flat Heat
Pipes at High Fluxes from Multiple Discrete Sources," Journal of Heat
Transfer, vol. 126, 2004, pp. 347-354.
[113]L. Kamenova, Y. Avenas, S. Tzanova, N. Popova, and C. Schaeffer, "2D
Numerical Modeling of the Thermal and Hydraulic Performances of a
Very Thin Sintered Powder Copper Flat Heat pipe," 37th IEEE Power
Electronics Specialist Conference (PESC 2006), Cheju Island, South
Korea, June 18-22, 2006, pp. 1130-1136.
[114]F. Lefèvre, and M. Lallemand, "Coupled Thermal Hydrodnamic Models
of Flat Micro Heat Pipes for Cooling of Multiple Electronic
Components," International Journal of Heat and Mass Transfer, vol.
49, 2006, pp. 1375-1383.
[115]Y. Koito, H. Imura, M. Mochizuki, Y. Saito, & S. Torii, "Numerical
Analysis and Experimental Verification on Thermal Fluid Phenomena in
a Vapor Chamber," Applied Thermal Engineering, vol. 26, 2006, pp.
1669-1676.
[116]M.S. El-Genk, H.H. Saber, and J.L. Parker, "Efficient Spreaders for
Cooling High-Power Computer Chips," Applied Thermal Engineering,
vol. 27, 2007, pp. 1072-1088.
[117]R. Sonan, S. Harmand, J. Pelle, D. Leger, and M. Fakes, "Transient
Thermal and hydrodynamic Model of Flat Heat Pipe for the Cooling of
Electronics Components," International Journal of Heat and Mass
transfer, vol. 51, no. 25-26, 2008, pp. 6006-6017.
[118]B. Xiao, & A. Faghri, "A Three-Dimensional Thermal-Fluid Analysis of
Flat Heat Pipes," International Journal Heat and Mass Transfer,
Vol.51, 2008, pp. 3113-3126.
[119]R. Ranjan, J.Y. Murthy, S.V. Garimella, and U. Vadakkan, "A
Numerical Model for Transport in Flat Heat Pipes Considering Wick
Microstructure Effects," International Journal of Heat and Mass
Transfer, vol. 54, 2011, pp. 153-168.
@article{"International Journal of Mechanical, Industrial and Aerospace Sciences:59445", author = "M.C. Zaghdoudi and S. Maalej and J. Mansouri and M.B.H. Sassi", title = "Flat Miniature Heat Pipes for Electronics Cooling: State of the Art, Experimental and Theoretical Analysis", abstract = "An experimental study is realized in order to verify the
Mini Heat Pipe (MHP) concept for cooling high power dissipation
electronic components and determines the potential advantages of
constructing mini channels as an integrated part of a flat heat pipe. A
Flat Mini Heat Pipe (FMHP) prototype including a capillary structure
composed of parallel rectangular microchannels is manufactured and
a filling apparatus is developed in order to charge the FMHP. The
heat transfer improvement obtained by comparing the heat pipe
thermal resistance to the heat conduction thermal resistance of a
copper plate having the same dimensions as the tested FMHP is
demonstrated for different heat input flux rates. Moreover, the heat
transfer in the evaporator and condenser sections are analyzed, and
heat transfer laws are proposed. In the theoretical part of this work, a
detailed mathematical model of a FMHP with axial microchannels is
developed in which the fluid flow is considered along with the heat
and mass transfer processes during evaporation and condensation.
The model is based on the equations for the mass, momentum and
energy conservation, which are written for the evaporator, adiabatic,
and condenser zones. The model, which permits to simulate several
shapes of microchannels, can predict the maximum heat transfer
capacity of FMHP, the optimal fluid mass, and the flow and thermal
parameters along the FMHP. The comparison between experimental
and model results shows the good ability of the numerical model to
predict the axial temperature distribution along the FMHP.", keywords = "Electronics Cooling, Micro Heat Pipe, Mini Heat Pipe, Mini Heat Spreader, Capillary grooves.", volume = "5", number = "3", pages = "677-24", }
