Enhancement of Natural Convection Heat Transfer within Closed Enclosure Using Parallel Fins

A numerical study of natural convection heat transfer
in water filled cavity has been examined in 3-Dfor single phase liquid
cooling system by using an array of parallel plate fins mounted to one
wall of a cavity. The heat generated by a heat source represents a
computer CPU with dimensions of 37.5∗37.5mm mounted on
substrate. A cold plate is used as a heat sink installed on the opposite
vertical end of the enclosure. The air flow inside the computer case is
created by an exhaust fan. A turbulent air flow is assumed and k-ε
model is applied. The fins are installed on the substrate to enhance
the heat transfer. The applied power energy range used is between 15
- 40W. In order to determine the thermal behaviour of the cooling
system, the effect of the heat input and the number of the parallel
plate fins are investigated. The results illustrate that as the fin number
increases the maximum heat source temperature decreases. However,
when the fin number increases to critical value the temperature start
to increase due to the fins are too closely spaced and that cause the
obstruction of water flow. The introduction of parallel plate fins
reduces the maximum heat source temperature by 10% compared to
the case without fins. The cooling system maintains the maximum
chip temperature at 64.68°C when the heat input was at 40W that is
much lower than the recommended computer chips limit temperature
of no more than 85°C and hence the performance of the CPU is
enhanced.

• F. A. Gdhaidh
• K. Hussain
• H. S. Qi

• Chips limit temperature
• closed enclosure
• natural convection
• parallel plate
• single phase liquid.

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