Numerical and Experimental Study of Heat Transfer Enhancement with Metal Foams and Ultrasounds

The aim of this experimental and numerical study is to analyze the effects of acoustic streaming generated by 40 kHz ultrasonic waves on heat transfer in forced convection, with and without 40 PPI aluminum metal foam. Preliminary dynamic and thermal studies were done with COMSOL Multiphase, to see heat transfer enhancement degree by inserting a 40PPI metal foam (10 × 2 × 3 cm) on a heat sink, after having determined experimentally its permeability and Forchheimer's coefficient. The results obtained numerically are in accordance with those obtained experimentally, with an enhancement factor of 205% for a velocity of 0.4 m/s compared to an empty channel. The influence of 40 kHz ultrasound on heat transfer was also tested with and without metallic foam. Results show a remarkable increase in Nusselt number in an empty channel with an enhancement factor of 37,5%, while no influence of ultrasound on heat transfer in metal foam presence.

Electronics Thermal Management Driven Design of an IP65-Rated Motor Inverter

Thermal management of electronic components packaged inside an IP65 rated enclosure is of prime importance in industrial applications. Electrical enclosure protects the multiple board configurations such as inverter, power, controller board components, busbars, and various power dissipating components from harsh environments. Industrial environments often experience relatively warm ambient conditions, and the electronic components housed in the enclosure dissipate heat, due to which the enclosures and the components require thermal management as well as reduction of internal ambient temperatures. Design of Experiments based thermal simulation approach with MOSFET arrangement, Heat sink design, Enclosure Volume, Copper and Aluminum Spreader, Power density, and Printed Circuit Board (PCB) type were considered to optimize air temperature inside the IP65 enclosure to ensure conducive operating temperature for controller board and electronic components through the different modes of heat transfer viz. conduction, natural convection and radiation using Ansys ICEPAK. MOSFET’s with the parallel arrangement, IP65 enclosure molded heat sink with rectangular fins on both enclosures, specific enclosure volume to satisfy the power density, Copper spreader to conduct heat to the enclosure, optimized power density value and selecting Aluminum clad PCB which improves the heat transfer were the contributors towards achieving a conducive operating temperature inside the IP-65 rated Motor Inverter enclosure. A reduction of 52 ℃ was achieved in internal ambient temperature inside the IP65 enclosure between baseline and final design parameters, which met the operative temperature requirements of the electronic components inside the IP-65 rated Motor Inverter.

Efficiency Enhancement of Photovoltaic Panels Using an Optimised Air Cooled Heat Sink

Solar panels that use photovoltaic (PV) cells are popular for converting solar radiation into electricity. One of the major problems impacting the performance of PV panels is the overheating caused by excessive solar radiation and high ambient temperatures, which degrades the efficiency of the PV panels remarkably. To overcome this issue, an aluminum heat sink was used to dissipate unwanted heat from PV cells. The dimensions of the heat sink were determined considering the optimal fin spacing that fulfils hot climatic conditions. In this study, the effects of cooling on the efficiency and power output of a PV panel were studied experimentally. Two PV modules were used: one without and one with a heat sink. The experiments ran for 11 hours from 6:00 a.m. to 5:30 p.m. where temperature readings in the rear and front of both PV modules were recorded at an interval of 15 minutes using sensors and an Arduino microprocessor. Results are recorded for both panels simultaneously for analysis, temperate comparison, and for power and efficiency calculations. A maximum increase in the solar to electrical conversion efficiency of 35% and almost 55% in the power output were achieved with the use of a heat sink, while temperatures at the front and back of the panel were reduced by 9% and 11%, respectively.

Triple Intercell Bar for Electrometallurgical Processes: A Design to Increase PV Energy Utilization

PV energy prices are declining rapidly. To take advantage of the benefits of those prices and lower the carbon footprint, operational practices must be modified. Undoubtedly, it challenges the electrowinning practice to operate at constant current throughout the day. This work presents a technology that contributes in providing modulation capacity to the electrode current distribution system. This is to raise the day time dc current and lower it at night. The system is a triple intercell bar that operates in current-source mode. The design is a capping board free dogbone type of bar that ensures an operation free of short circuits, hot swapability repairs and improved current balance. This current-source system eliminates the resetting currents circulating in equipotential bars. Twin auxiliary connectors are added to the main connectors providing secure current paths to bypass faulty or impaired contacts. All system conductive elements are positioned over a baseboard offering a large heat sink area to the ventilation of a facility. The system works with lower temperature than a conventional busbar. Of these attributes, the cathode current balance property stands out and is paramount for day/night modulation and the use of photovoltaic energy. A design based on a 3D finite element method model predicting electric and thermal performance under various industrial scenarios is presented. Preliminary results obtained in an electrowinning facility with industrial prototypes are included.

Specification Requirements for a Combined Dehumidifier/Cooling Panel: A Global Scale Analysis

The use of a radiant cooling solution would enable to lower cooling needs which is of great interest when the demand is initially high (hot climate). But, radiant systems are not naturally compatibles with humid climates since a low-temperature surface leads to condensation risks as soon as the surface temperature is close to or lower than the dew point temperature. A radiant cooling system combined to a dehumidification system would enable to remove humidity for the space, thereby lowering the dew point temperature. The humidity removal needs to be especially effective near the cooled surface. This requirement could be fulfilled by a system using a single desiccant fluid for the removal of both excessive heat and moisture. This task aims at providing an estimation of the specification requirements of such system in terms of cooling power and dehumidification rate required to fulfill comfort issues and to prevent any condensation risk on the cool panel surface. The present paper develops a preliminary study on the specification requirements, performances and behavior of a combined dehumidifier/cooling ceiling panel for different operating conditions. This study has been carried using the TRNSYS software which allows nodal calculations of thermal systems. It consists of the dynamic modeling of heat and vapor balances of a 5m x 3m x 2.7m office space. In a first design estimation, this room is equipped with an ideal heating, cooling, humidification and dehumidification system so that the room temperature is always maintained in between 21◦C and 25◦C with a relative humidity in between 40% and 60%. The room is also equipped with a ventilation system that includes a heat recovery heat exchanger and another heat exchanger connected to a heat sink. Main results show that the system should be designed to meet a cooling power of 42W.m−2 and a desiccant rate of 45 gH2O.h−1. In a second time, a parametric study of comfort issues and system performances has been achieved on a more realistic system (that includes a chilled ceiling) under different operating conditions. It enables an estimation of an acceptable range of operating conditions. This preliminary study is intended to provide useful information for the system design.

Cascaded Transcritical/Supercritical CO2 Cycles and Organic Rankine Cycles to Recover Low-Temperature Waste Heat and LNG Cold Energy Simultaneously

Low-temperature waste heat is abundant in the process industries, and large amounts of Liquefied Natural Gas (LNG) cold energy are discarded without being recovered properly in LNG terminals. Power generation is an effective way to utilize low-temperature waste heat and LNG cold energy simultaneously. Organic Rankine Cycles (ORCs) and CO2 power cycles are promising technologies to convert low-temperature waste heat and LNG cold energy into electricity. If waste heat and LNG cold energy are utilized simultaneously in one system, the performance may outperform separate systems utilizing low-temperature waste heat and LNG cold energy, respectively. Low-temperature waste heat acts as the heat source and LNG regasification acts as the heat sink in the combined system. Due to the large temperature difference between the heat source and the heat sink, cascaded power cycle configurations are proposed in this paper. Cascaded power cycles can improve the energy efficiency of the system considerably. The cycle operating at a higher temperature to recover waste heat is called top cycle and the cycle operating at a lower temperature to utilize LNG cold energy is called bottom cycle in this study. The top cycle condensation heat is used as the heat source in the bottom cycle. The top cycle can be an ORC, transcritical CO2 (tCO2) cycle or supercritical CO2 (sCO2) cycle, while the bottom cycle only can be an ORC due to the low-temperature range of the bottom cycle. However, the thermodynamic path of the tCO2 cycle and sCO2 cycle are different from that of an ORC. The tCO2 cycle and the sCO2 cycle perform better than an ORC for sensible waste heat recovery due to a better temperature match with the waste heat source. Different combinations of the tCO2 cycle, sCO2 cycle and ORC are compared to screen the best configurations of the cascaded power cycles. The influence of the working fluid and the operating conditions are also investigated in this study. Each configuration is modeled and optimized in Aspen HYSYS. The results show that cascaded tCO2/ORC performs better compared with cascaded ORC/ORC and cascaded sCO2/ORC for the case study.

Optimization of Design Parameters for Wire Mesh Fin Arrays as a Heat Sink Using Taguchi Method

Heat transfer enhancement objects like extended surfaces, fins etc. are chosen for their thermal performance as well as for other design parameters depending on various applications. The present paper is on experimental study to investigate the heat transfer enhancement through wire mesh fin arrays equipped with horizontal base plate. The data used in performance analysis were obtained experimentally for the material (mild steel) for different heat inputs such as 40, 60, 80, 100 and 120 watt, by varying wire mesh diameter, fin height and spacing between two fin arrays. Using the Taguchi experimental design method, optimum design parameters and their levels were investigated. Average heat transfer coefficient was considered as a performance characteristic parameter. An L9 (33) orthogonal array was selected as an experimental plan. Optimum results were found by experimenting. It is observed that the wire mesh diameter and fin height have a higher impact on heat transfer coefficient as compared to spacing between two fin arrays.

Improved Small-Signal Characteristics of Infrared 850 nm Top-Emitting Vertical-Cavity Lasers

High-speed infrared vertical-cavity surface-emitting laser diodes (VCSELs) with Cu-plated heat sinks were fabricated and tested. VCSELs with 10 mm aperture diameter and 4 mm of electroplated copper demonstrated a -3dB modulation bandwidth (f-3dB) of 14 GHz and a resonance frequency (fR) of 9.5 GHz at a bias current density (Jbias) of only 4.3 kA/cm2, which corresponds to an improved f-3dB2/Jbias ratio of 44 GHz2/kA/cm2. At higher and lower bias current densities, the f-3dB2/ Jbias ratio decreased to about 30 GHz2/kA/cm2 and 18 GHz2/kA/cm2, respectively. Examination of the analogue modulation response demonstrated that the presented VCSELs displayed a steady f-3dB/ fR ratio of 1.41±10% over the whole range of the bias current (1.3Ith to 6.2Ith). The devices also demonstrated a maximum modulation bandwidth (f-3dB max) of more than 16 GHz at a bias current less than the industrial bias current standard for reliability by 25%.

Experimental Analyses of Thermoelectric Generator Behavior Using Two Types of Thermoelectric Modules for Marine Application

Thermal power technology such as the TEG (Thermo-Electric Generator) arouses significant attention worldwide for waste heat recovery. Despite the potential benefits of marine application due to the permanent heat sink from sea water, no significant studies on this application were to be found. In this study, a test rig has been designed and built to test the performance of the TEG on engine operating points. The TEG device is built from commercially available materials for the sake of possible economical application. Two types of commercial TEM (thermo electric module) have been studied separately on the test rig. The engine data were extracted from a commercial Diesel engine since it shares the same principle in terms of engine efficiency and exhaust with the marine Diesel engine. An open circuit water cooling system is used to replicate the sea water cold source. The characterization tests showed that the silicium-germanium alloys TEM proved a remarkable reliability on all engine operating points, with no significant deterioration of performance even under sever variation in the hot source conditions. The performance of the bismuth-telluride alloys was 100% better than the first type of TEM but it showed a deterioration in power generation when the air temperature exceeds 300 °C. The temperature distribution on the heat exchange surfaces revealed no useful combination of these two types of TEM with this tube length, since the surface temperature difference between both ends is no more than 10 °C. This study exposed the perspective of use of TEG technology for marine engine exhaust heat recovery. Although the results suggested non-sufficient power generation from the low cost commercial TEM used, it provides valuable information about TEG device optimization, including the design of heat exchanger and the types of thermo-electric materials.

A Detailed Review on Pin Fin Heat Sink

Heat sinks are being considered in many advanced heat transfer applications including automotive and stationary fuel cells as well as cooling of electronic devices. However, there are innumerable fundamental issues in the fields of heat transfer and fluid mechanics perspectives which remains unresolved. The present review emphasizes on the progress of research in the field of pin fin heat sinks, while understanding the fluid dynamics and heat transfer characteristics with a detailed and sophisticated prediction of the temperature distribution, high heat flux removal and by minimizing thermal resistance. Lot of research work carried out across the globe to address this challenge and trying to come up with an economically viable and user friendly solution. The high activities for future pin fin heat sinks research and development to meet the current issue is recorded in this article.

Effect of Loop Diameter, Height and Insulation on a High Temperature CO2 Based Natural Circulation Loop

Natural circulation loops (NCLs) are buoyancy driven flow systems without any moving components. NCLs have vast applications in geothermal, solar and nuclear power industry where reliability and safety are of foremost concern. Due to certain favorable thermophysical properties, especially near supercritical regions, carbon dioxide can be considered as an ideal loop fluid in many applications. In the present work, a high temperature NCL that uses supercritical carbon dioxide as loop fluid is analysed. The effects of relevant design and operating variables on loop performance are studied. The system operating under steady state is modelled taking into account the axial conduction through loop fluid and loop wall, and heat transfer with surroundings. The heat source is considered to be a heater with controlled heat flux and heat sink is modelled as an end heat exchanger with water as the external cold fluid. The governing equations for mass, momentum and energy conservation are normalized and are solved numerically using finite volume method. Results are obtained for a loop pressure of 90 bar with the power input varying from 0.5 kW to 6.0 kW. The numerical results are validated against the experimental results reported in the literature in terms of the modified Grashof number (Grm) and Reynolds number (Re). Based on the results, buoyancy and friction dominated regions are identified for a given loop. Parametric analysis has been done to show the effect of loop diameter, loop height, ambient temperature and insulation. The results show that for the high temperature loop, heat loss to surroundings affects the loop performance significantly. Hence this conjugate heat transfer between the loop and surroundings has to be considered in the analysis of high temperature NCLs.

Numerical Simulations of Electronic Cooling with In-Line and Staggered Pin Fin Heat Sinks

Three-dimensional incompressible turbulent fluid flow and heat transfer of pin fin heat sinks using air as a cooling fluid are numerically studied in this study. Two different kinds of pin fins are compared in the thermal performance, including circular and square cross sections, both are in-line and staggered arrangements. The turbulent governing equations are solved using a control-volume- based finite-difference method. Subsequently, numerical computations are performed with the realizable k - ԑ turbulence for the parameters studied, the fin height H, fin diameter D, and Reynolds number (Re) in the range of 7 ≤ H ≤ 10, 0.75 ≤ D ≤ 2, 2000 ≤ Re ≤ 126000 respectively. The numerical results are validated with available experimental data in the literature and good agreement has been found. It indicates that circular pin fins are streamlined in comparing with the square pin fins, the pressure drop is small than that of square pin fins, and heat transfer is not as good as the square pin fins. The thermal performance of the staggered pin fins is better than that of in-line pin fins because the staggered arrangements produce large disturbance. Both in-line and staggered arrangements show the same behavior for thermal resistance, pressure drop, and the entropy generation.

Localized and Time-Resolved Velocity Measurements of Pulsatile Flow in a Rectangular Channel

The exploitation of flow pulsation in micro- and mini-channels is a potentially useful technique for enhancing cooling of high-end photonics and electronics systems. It is thought that pulsation alters the thickness of the hydrodynamic and thermal boundary layers, and hence affects the overall thermal resistance of the heat sink. Although the fluid mechanics and heat transfer are inextricably linked, it can be useful to decouple the parameters to better understand the mechanisms underlying any heat transfer enhancement. Using two-dimensional, two-component particle image velocimetry, the current work intends to characterize the heat transfer mechanisms in pulsating flow with a mean Reynolds number of 48 by experimentally quantifying the hydrodynamics of a generic liquid-cooled channel geometry. Flows circulated through the test section by a gear pump are modulated using a controller to achieve sinusoidal flow pulsations with Womersley numbers of 7.45 and 2.36 and an amplitude ratio of 0.75. It is found that the transient characteristics of the measured velocity profiles are dependent on the speed of oscillation, in accordance with the analytical solution for flow in a rectangular channel. A large velocity overshoot is observed close to the wall at high frequencies, resulting from the interaction of near-wall viscous stresses and inertial effects of the main fluid body. The steep velocity gradients at the wall are indicative of augmented heat transfer, although the local flow reversal may reduce the upstream temperature difference in heat transfer applications. While unsteady effects remain evident at the lower frequency, the annular effect subsides and retreats from the wall. The shear rate at the wall is increased during the accelerating half-cycle and decreased during deceleration compared to steady flow, suggesting that the flow may experience both enhanced and diminished heat transfer during a single period. Hence, the thickness of the hydrodynamic boundary layer is reduced for positively moving flow during one half of the pulsation cycle at the investigated frequencies. It is expected that the size of the thermal boundary layer is similarly reduced during the cycle, leading to intervals of heat transfer enhancement.

Study of Natural Convection Heat Transfer of Plate-Fin Heat Sink in a Closed Enclosure

The present study applies the inverse method and three-dimensional CFD commercial software in conjunction with the experimental temperature data to investigate the heat transfer and fluid flow characteristics of the plate-fin heat sink in a rectangular closed enclosure. The inverse method with the finite difference method and the experimental temperature data is applied to determine the approximate heat transfer coefficient. Later, based on the obtained results, the zero-equation turbulence model is used to obtain the heat transfer and fluid flow characteristics between two fins. T0 validate the accuracy of the results obtained, the comparison of the heat transfer coefficient is made. The obtained temperature at selected measurement locations of the fin is also compared with experimental data. The effect of the height of the rectangular enclosure on the obtained results is discussed.

Experimental and Numerical Analysis of Built-In Thermoelectric Generator Modules with an Elliptical Pin-Fin Heat Sink

A three-dimensional numerical model of thermoelectric generator (TEG) modules attached to a large chimney plate is proposed and solved numerically using a control volume based finite difference formulation. The TEG module consists of a thermoelectric generator, an elliptical pin-fin heat sink, and a cold plate for water cooling. In the chimney, the temperature of flue gases is 450-650K. Although the TEG hot-side temperature and thus the electric power output can be increased by inserting an elliptical pin-fin heat sink into the chimney tunnel to increase the heat transfer area, the pin fin heat sink would cause extra pumping power at the same time. The main purpose of this study is to analyze the effects of geometrical parameters on the electric power output and chimney pressure drop characteristics. The effects of different operating conditions, including various inlet velocities (Vin= 1, 3, 5 m/s), inlet temperatures (Tgas = 450, 550, 650K) and different fin height (0 to 150 mm) are discussed in detail. The predicted numerical data for the power vs. current (P-I) curve are in good agreement (within 11%) with the experimental data.

The Effect of CPU Location in Total Immersion of Microelectronics

Meeting the growth in demand for digital services such as social media, telecommunications, and business and cloud services requires large scale data centres, which has led to an increase in their end use energy demand. Generally, over 30% of data centre power is consumed by the necessary cooling overhead. Thus energy can be reduced by improving the cooling efficiency. Air and liquid can both be used as cooling media for the data centre. Traditional data centre cooling systems use air, however liquid is recognised as a promising method that can handle the more densely packed data centres. Liquid cooling can be classified into three methods; rack heat exchanger, on-chip heat exchanger and full immersion of the microelectronics. This study quantifies the improvements of heat transfer specifically for the case of immersed microelectronics by varying the CPU and heat sink location. Immersion of the server is achieved by filling the gap between the microelectronics and a water jacket with a dielectric liquid which convects the heat from the CPU to the water jacket on the opposite side. Heat transfer is governed by two physical mechanisms, which is natural convection for the fixed enclosure filled with dielectric liquid and forced convection for the water that is pumped through the water jacket. The model in this study is validated with published numerical and experimental work and shows good agreement with previous work. The results show that the heat transfer performance and Nusselt number (Nu) is improved by 89% by placing the CPU and heat sink on the bottom of the microelectronics enclosure.

Enhancement of Natural Convection Heat Transfer within Closed Enclosure Using Parallel Fins

A numerical study of natural convection heat transfer in water filled cavity has been examined in 3-Dfor single phase liquid cooling system by using an array of parallel plate fins mounted to one wall of a cavity. The heat generated by a heat source represents a computer CPU with dimensions of 37.5∗37.5mm mounted on substrate. A cold plate is used as a heat sink installed on the opposite vertical end of the enclosure. The air flow inside the computer case is created by an exhaust fan. A turbulent air flow is assumed and k-ε model is applied. The fins are installed on the substrate to enhance the heat transfer. The applied power energy range used is between 15 - 40W. In order to determine the thermal behaviour of the cooling system, the effect of the heat input and the number of the parallel plate fins are investigated. The results illustrate that as the fin number increases the maximum heat source temperature decreases. However, when the fin number increases to critical value the temperature start to increase due to the fins are too closely spaced and that cause the obstruction of water flow. The introduction of parallel plate fins reduces the maximum heat source temperature by 10% compared to the case without fins. The cooling system maintains the maximum chip temperature at 64.68°C when the heat input was at 40W that is much lower than the recommended computer chips limit temperature of no more than 85°C and hence the performance of the CPU is enhanced.

Numerical Investigation of Nanofluid Based Thermosyphon System

A thermosyphon system is a heat transfer loop which operates on the basis of gravity and buoyancy forces. It guarantees a good reliability and low maintenance cost as it does not involve any mechanical pump. Therefore, it can be used in many industrial applications such as refrigeration and air conditioning, electronic cooling, nuclear reactors, geothermal heat extraction, etc. But flow instabilities and loop configuration are the major problems in this system. Several previous researchers studied that stabilities can be suppressed by using nanofluids as loop fluid. In the present study a rectangular thermosyphon loop with end heat exchangers are considered for the study. This configuration is more appropriate for many practical applications such as solar water heater, geothermal heat extraction, etc. In the present work, steady-state analysis is carried out on thermosyphon loop with parallel flow coaxial heat exchangers at heat source and heat sink. In this loop nanofluid is considered as the loop fluid and water is considered as the external fluid in both hot and cold heat exchangers. For this analysis onedimensional homogeneous model is developed. In this model, conservation equations like conservation of mass, momentum, energy are discretized using finite difference method. A computer code is written in MATLAB to simulate the flow in thermosyphon loop. A comparison in terms of heat transfer is made between water and nanofluid as working fluids in the loop.

Numerical Study of Heat Release of the Symmetrically Arranged Extruded-Type Heat Sinks

In this numerical study, we want to present the design of highly efficient extruded-type heat sink. The symmetrically arranged extruded-type heat sinks are used instead of a single extruded or swaged-type heat sink. In this parametric study, the maximum temperatures, the base temperatures between heaters, and the heat release rates were investigated with respect to the arrangements of heat sources, air flow rates, and amounts of heat input. Based on the results we believe that the use of both side of heat sink is to be much better for release the heat than the use of single side. Also from the results, it is believed that the symmetric arrangement of heat sources is recommended to achieve a higher heat transfer from the heat sink.

Numerical Optimization of Trapezoidal Microchannel Heat Sinks

This study presents the numerical simulation of three-dimensional incompressible steady and laminar fluid flow and conjugate heat transfer of a trapezoidal microchannel heat sink using water as a cooling fluid in a silicon substrate. Navier-Stokes equations with conjugate energy equation are discretized by finite-volume method. We perform numerical computations for a range of 50 ≦ Re ≦ 600, 0.05W ≦ P ≦ 0.8W, 20W/cm2 ≦q"≦ 40W/cm2. The present study demonstrates the numerical optimization of a trapezoidal microchannel heat sink design using the response surface methodology (RSM) and the genetic algorithm method (GA). The results show that the average Nusselt number increases with an increase in the Reynolds number or pumping power, and the thermal resistance decreases as the pumping power increases. The thermal resistance of a trapezoidal microchannel is minimized for a constant heat flux and constant pumping power.