Abstract: The heat pipe is a thermal device which allows efficient transport of thermal energy. The experimental work of this research was split into two phases; phase 1 is the development of the facilities, material and test rig preparation. Phase 2 is the actual experiments and measurements of the thermal control mockup inside the modified vacuum chamber (MVC). Due to limited funds, the development on the thermal control subsystem was delayed and the experimental facilities such as suitable thermal vacuum chamber with space standard specifications were not available from the beginning of the research and had to be procured over a period of time. In all, these delays extended the project by one and a half year. Thermal control subsystem needs a special facility and equipment to be tested. The available vacuum chamber is not suitable for the thermal tests. Consequently, the modification of the chamber was a must. A vacuum chamber has been modified to be used as a Thermal Vaccum Chamber (TVC). A MVC is a vacuum chamber modified by using a stainless mirror box with perfect reflectability and the infrared lamp connected with the voltage regulator to vary the lamp intensity as it will be illustrated through the paper.
Abstract: Recycling, as part of any sustainable environment, is continuously evolving and impacting on new materials in manufacturing. One example of this is the recycled solid waste of Tetra Pak ™ packaging, which is a highly pollutant waste as it is not biodegradable since it is manufactured with different materials. The Tetra Pak ™ container consists of thermally joined layers of paper, aluminum and polyethylene. Once disposed, this packaging is recycled by completely separating the paperboard from the rest of the materials. The aluminum and the polyethylene remain together and are used to create the poly-aluminum, which is widely used to manufacture roof tiles. These recycled tiles have different thermal and acoustic properties compared with traditional manufactured ceramic and cement tiles. In this work, we compare a group of tiles using nondestructive optical testing to measure the superficial micro deformations of the tiles under well controlled experiments. The results of the acoustic and thermal tests show remarkable differences between the recycled tile and the traditional ones. These results help to determine which tile could be better suited to the specific environmental conditions in countries where extreme climates, ranging from tropical, desert-like, to very cold are experienced throughout the year.
Abstract: Due to the higher power loss levels in electronic components, the thermal design of PCBs (Printed Circuit Boards) of an assembled device becomes one of the most important quality factors in electronics. Nonetheless, some of leading causes of the microelectronic component failures are due to higher temperatures, the leakages or thermal-mechanical stress, which is a concern, is the reliability of microelectronic packages. This article presents an experimental approach to measure the junction temperature of exposed pad packages. The implemented solution is in a prototype phase, using a temperature-sensitive parameter (TSP) to measure temperature directly on the die, validating the numeric results provided by the Mechanical APDL (Ansys Parametric Design Language) under same conditions. The physical device-under-test is composed by a Thermal Test Chip (TTC-1002) and assembly in a QFN cavity, soldered to a test-board according to JEDEC Standards. Monitoring the voltage drop across a forward-biased diode, is an indirectly method but accurate to obtain the junction temperature of QFN component with an applied power range between 0,3W to 1.5W. The temperature distributions on the PCB test-board and QFN cavity surface were monitored by an infra-red thermal camera (Goby-384) controlled and images processed by the Xeneth software. The article provides a set-up to monitorize in real-time the junction temperature of ICs, namely devices with the exposed pad package (i.e. QFN). Presenting the PCB layout parameters that the designer should use to improve thermal performance, and evaluate the impact of voids in solder interface in the device junction temperature.
Abstract: How to simulate experimentally the air flow and heat
transfer under microgravity on the ground is important, which has not
been completely solved so far. Influence of gravity on air natural
convection results in convection heat transfer on ground difference
from that on orbit. In order to obtain air temperature and velocity
deviations of manned spacecraft during terrestrial thermal test,
dimensionless number analysis and numerical simulation analysis are
performed. The calculated temperature distribution and velocity
distribution of the horizontal test cases are compared to the vertical
cases. The results show that the influence of gravity is neglected for
facility drawer racks and more obvious for vertical cabins.
Abstract: A satellite is being integrated and tested by BISEE (Beijing Institute of Spacecraft Environment Engineering). This paper describes the infrared lamp array simulation technology used for satellite thermal balance and thermal vacuum test. These tests were performed in KM6 space environmental simulator in Beijing, China. New software and hardware developed by BISEE, along with enhanced heat flux uniformity, provided for well accomplished thermal balance and thermal vacuum tests. The flux uniformity of lamp array was satisfied with test requirement. Monitored background radiometer offered reliable heat flux measurements with remarkable repeatability. Simulation software supplied accurate thermal flux distribution predictions.