Abstract: This paper deals with the modified wireless power transmission system for biomedical implanted devices. The system consists of efficient class-E power amplifier and inductive power links based on spiral circular transmitter and receiver coils. The model of the class-E power amplifier operated with 13.56 MHz is designed, discussed and analyzed in which it is achieved 87.2% of efficiency. The inductive coupling method is used to achieve link efficiency up to 73% depending on the electronic remote system resistance. The improved system powered with 3.3 DC supply and the voltage across the transmitter side is 40 V whereas, cross the receiver side is 12 V which is rectified to meet the implanted micro-system circuit requirements. The system designed and simulated by NI MULTISIM 11.02.
Abstract: This paper presented a modified efficient inductive
powering link based on ASK modulator and proposed efficient class-
E power amplifier. The design presents the external part which is
located outside the body to transfer power and data to the implanted
devices such as implanted Microsystems to stimulate and monitoring
the nerves and muscles. The system operated with low band
frequency 10MHZ according to industrial- scientific – medical (ISM)
band to avoid the tissue heating. For external part, the modulation
index is 11.1% and the modulation rate 7.2% with data rate 1 Mbit/s
assuming Tbit = 1us. The system has been designed using 0.35-μm
fabricated CMOS technology. The mathematical model is given and
the design is simulated using OrCAD P Spice 16.2 software tool and
for real-time simulation, the electronic workbench MULISIM 11 has
been used.
Abstract: This paper presented a proposed design for
transcutaneous inductive powering links. The design used to transfer
power and data to the implanted devices such as implanted
Microsystems to stimulate and monitoring the nerves and muscles.
The system operated with low band frequency 13.56 MHZ according
to industrial- scientific – medical (ISM) band to avoid the tissue
heating. For external part, the modulation index is 13 % and the
modulation rate 7.3% with data rate 1 Mbit/s assuming Tbit=1us. The
system has been designed using 0.35-μm fabricated CMOS
technology. The mathematical model is given and the design is
simulated using OrCAD P Spice 16.2 software tool and for real-time
simulation the electronic workbench MULISIM 11 has been used.
The novel circular plane (pancake) coils was simulated using
ANSOFT- HFss software.