Abstract: We present an integration approach of a CMOS biosensor into a polymer based microfluidic environment suitable for mass production. It consists of a wafer-level-package for the silicon die and laser bonding process promoted by an intermediate hot melt foil to attach the sensor package to the microfluidic chip, without the need for dispensing of glues or underfiller. A very good condition of the sensing area was obtained after introducing a protection layer during packaging. A microfluidic flow cell was fabricated and shown to withstand pressures up to Δp = 780 kPa without leakage. The employed biosensors were electrically characterized in a dry environment.
Abstract: Void formation in underfill is considered as failure
in flip chip manufacturing process. Void formation possibly caused
by several factors such as poor soldering and flux residue during
die attach process, void entrapment due moisture contamination,
dispense pattern process and setting up the curing process. This
paper presents the comparison of single step and two steps curing
profile towards the void and black dots formation in underfill for
Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA).
Statistic analysis was conducted to analyze how different factors
such as wafer lot, sawing technique, underfill fillet height and
curing profile recipe were affected the formation of voids and
black dots. A C-Mode Scanning Aqoustic Microscopy (C-SAM)
was used to scan the total count of voids and black dots. It was
shown that the 2 steps curing profile provided solution for void
elimination and black dots in underfill after curing process.