Abstract: The toxicity of lead associated with the lifecycle of perovskite solar cells (PSCs( is a serious concern which may prove to be a major hurdle in the path toward their commercialization. The current proposed lead-free PSCs including Ag(I), Bi(III), Sb(III), Ti(IV), Ge(II), and Sn(II) low-toxicity cations are still plagued with the critical issues of poor stability and low efficiency. This is mainly because of their chemical stability. In the present research, utilization of all inorganic CsSnGeI3 based materials offers the advantages to enhance resistance of device to degradation, reduce the cost of cells, and minimize the carrier recombination. The presence of inorganic halide perovskite improves the photovoltaic parameters of PCSs via improved surface coverage and stability. The inverted structure of simulated devices using a 1D simulator like solar cell capacitance simulator (SCAPS) version 3308 involves TCOHTL/Perovskite/ETL/Au contact layer. PEDOT:PSS, PCBM, and CsSnGeI3 used as hole transporting layer (HTL), electron transporting layer (ETL), and perovskite absorber layer in the inverted structure for the first time. The holes are injected from highly stable and air tolerant Sn0.5Ge0.5I3 perovskite composition to HTM and electrons from the perovskite to ETL. Simulation results revealed a great dependence of power conversion efficiency (PCE) on the thickness and defect density of perovskite layer. Here the effect of an increase in operating temperature from 300 K to 400 K on the performance of CsSnGeI3 based perovskite devices is investigated. Comparison between simulated CsSnGeI3 based PCSs and similar real testified devices with spiro-OMeTAD as HTL showed that the extraction of carriers at the interfaces of perovskite absorber depends on the energy level mismatches between perovskite and HTL/ETL. We believe that optimization results reported here represent a critical avenue for fabricating the stable, low-cost, efficient, and eco-friendly all-inorganic Cs-Sn-Ge based lead-free perovskite devices.
Abstract: Alkaline niobate (Na0.5K0.5)NbO3 ceramic system has attracted major attention in view of its potential for replacing the highly toxic but superior lead zirconate titanate (PZT) system for piezoelectric applications. Recently, a more detailed study of this system reveals that the ferroelectric and piezoelectric properties are optimized in the Li- and V-modified system having the composition (K0.485Na0.5Li0.015)(Nb0.98V0.02)O3. In the present work, we further study the pyroelectric behaviour of this composition along with another doped with Mn4+. So, (K0.485Na0.5Li0.015)(Nb0.98V0.02)O3 + x MnO2 (x = 0, and 0.01 wt. %) ceramic compositions were synthesized by conventional ceramic processing route. X-ray diffraction study reveals that both the undoped and Mn4+-doped ceramic samples prepared crystallize into a perovskite structure having orthorhombic symmetry. Dielectric study indicates that Mn4+ doping has little effect on both the Curie temperature (Tc) and tetragonal-orthorhombic phase transition temperature (Tot). The bulk density, room-temperature dielectric constant (εRT), and room-c The room-temperature coercive field (Ec) is observed to be lower in Mn4+ doped sample. The detailed analysis of the P-E hysteresis loops over the range of temperature from about room temperature to Tot points out that enhanced ferroelectric properties exist in this temperature range with better thermal stability for the Mn4+ doped ceramic. The study reveals that small traces of Mn4+ can modify (K0.485Na0.5Li0.015)(Nb0.98V0.02)O3 system so as to improve its ferroelectric properties with good thermal stability over a wide range of temperature.
Abstract: Nanocrystalline powders of the lead-free piezoelectric
material, tantalum-substituted potassium sodium niobate
(K0.5Na0.5)(Nb0.9Ta0.1)O3 (KNNT), were produced using a Retsch
PM100 planetary ball mill by setting the milling time to 15h, 20h,
25h, 30h, 35h and 40h, at a fixed speed of 250rpm. The average
particle size of the milled powders was found to decrease from 12nm
to 3nm as the milling time increases from 15h to 25h, which is in
agreement with the existing theoretical model. An anomalous
increase to 98nm and then a drop to 3nm in the particle size were
observed as the milling time further increases to 30h and 40h
respectively. Various sizes of these starting KNNT powders were
used to investigate the effect of milling time on the microstructure,
dielectric properties, phase transitions and piezoelectric properties of
the resulting KNNT ceramics. The particle size of starting KNNT
was somewhat proportional to the grain size. As the milling time
increases from 15h to 25h, the resulting ceramics exhibit
enhancement in the values of relative density from 94.8% to 95.8%,
room temperature dielectric constant (εRT) from 878 to 1213, and
piezoelectric charge coefficient (d33) from 108pC/N to 128pC/N. For
this range of ceramic samples, grain size refinement suppresses the
maximum dielectric constant (εmax), shifts the Curie temperature (Tc)
to a lower temperature and the orthorhombic-tetragonal phase
transition (Tot) to a higher temperature. Further increase of milling
time from 25h to 40h produces a gradual degradation in the values of
relative density, εRT, and d33 of the resulting ceramics.
Abstract: New lead-free ferroelectric relaxor ceramics were
prepared by conventional solid-state synthesis in the BaTiO3-Bi2O3-
Y2O3 systems. Some of these ceramics present a ferroelectric relaxor
with transition temperature close to room temperature. These new
materials are very interesting for applications and can replace leadbased
ceramic to prevent the toxic pollutions during the preparation
state. In the other hand, the energy band diagram shows the
potentiality of these compounds for the solar energy conversion.
Thus, some compositions have been tested successfully for H2
production upon visible light. The best activity occurs in alkaline
media with a rate evolution of about 0.15 mL g-1 mn-1 and a quantum
yield of 1% under polychromatic light.
Abstract: Microstructure, wetting behavior and interfacial
reactions between Sn–0.7Cu and Sn–0.3Ag–0.7Cu (SAC0307)
solders solidified on Ni coated Al substrates were compared and
investigated. Microstructure of Sn–0.7Cu alloy exhibited a eutectic
matrix composed of primary β-Sn dendrites with a fine dispersion of
Cu6Sn5 intermetallics whereas microstructure of SAC0307 alloy
exhibited coarser Cu6Sn5 and finer Ag3Sn precipitates of IMCs with
decreased tin dendrites. Contact angles ranging from 22° to 26° were
obtained for Sn–0.7Cu solder solidified on substrate surface whereas
for SAC0307 solder alloy contact angles were found to be in the
range of 20° to 22°. Sn–0.7Cu solder/substrate interfacial region
exhibited faceted (Cu, Ni)6Sn5 IMCs protruding into the solder matrix
and a small amount of (Cu, Ni)3Sn4 intermetallics at the interface.
SAC0307 solder/substrate interfacial region showed mainly (Cu,
Ni)3Sn4 intermetallics adjacent to the coating layer and (Cu,
Ni)6Sn5 IMCs in the solder matrix. The improvement in the
wettability of SAC0307 solder alloy on substrate surface is attributed
to the formation of cylindrical shape (Cu,Ni)6Sn5 and a layer of
(Cu, Ni)3Sn4 IMCs at the interface.