Abstract: Triple-Level Cell (TLC) NAND Flash memory at, and
below, 20nm (nanometer) is still largely unexplored by researchers,
and with the ever more commonplace existence of Flash in consumer
and enterprise applications there is a need for such gaps in knowledge
to be filled. At the time of writing, there was little published data
or literature on TLC, and more specifically reliability testing, with
a further emphasis on both endurance and retention. This paper
will give an introduction to NAND Flash memory, followed by an
overview of the relevant current research on the reliability of Flash
memory, along with the planned future work which will provide
results to help characterise the reliability of TLC memory.
Abstract: Flash memory has become an important storage device
in many embedded systems because of its high performance, low
power consumption and shock resistance. Multi-level cell (MLC) is
developed as an effective solution for reducing the cost and increasing
the storage density in recent years. However, most of flash file system
cannot handle the error correction sufficiently. To correct more errors
for MLC, we implement Reed-Solomon (RS) code to YAFFS, what is
widely used for flash-based file system. RS code has longer computing
time but the correcting ability is much higher than that of Hamming
code.
Abstract: The flash memory has many advantages such as low power consumption, strong shock resistance, fast I/O and non-volatility. And it is increasingly used in the mobile storage device. The YAFFS, one of the NAND flash file system, is widely used in the embedded device. However, the existing YAFFS takes long time to mount the file system because it scans whole spare areas in all pages of NAND flash memory. In order to solve this problem, we propose a new content-based flash file system using a mounting time reduction technique. The proposed method only scans partial spare areas of some special pages by using content-based block management. The experimental results show that the proposed method reduces the average mounting time by 87.2% comparing with JFFS2 and 69.9% comparing with YAFFS.