Abstract: An innovative design for intelligent Chemical Mechanical Polishing (CMP) system is proposed and verified by experiments in this report. On-line measurement and real-time feedback are integrated to eliminate the shortcomings of traditional approaches, e.g., the batch-to-batch discrepancy of required polishing time, over consumption of chemical slurry, and non-uniformity across the wafer. The major advantage of the proposed method is that the finish of local surface roughness can be consistent, no matter where the inner-ring region or outer-ring region is concerned. Secondly, it is able to eliminate the Edge effect. Conventionally, the interfacial induced stress near the wafer edge is generally much higher than that near the wafer center. At last, by using the proposed intelligent chemical mechanical polishing strategy, the cost of the entire machining cycle can be much reduced while the quality of the finished goods certainly upgraded.
Abstract: For micro-gyroscopes, the angular rate detection components have to oscillate forwards and backwards alternatively. An innovative design of micro-electromagnetic drive module is proposed to make a Π-type disc reciprocally and efficiently rotate within a certain of angular interval. Twelve Electromagnetic poles enclosing the thin disc are designed to provide the magnetic drive power. Isotropic etching technique is employed to fabricate the high-aspect-ratio trench, so that the contact angle of wire against trench can be increased and the potential defect of cavities and pores within the wire can be prevented. On the other hand, a Π-type thin disc is designed to conduct the pitch motion as an angular excitation, in addition to spinning, is exerted on the gyroscope. The efficacy of the micro-magnetic drive module is verified by the commercial software, Ansoft Maxewll. In comparison with the conventional planar windings in micro-scale systems, the magnetic drive force is increased by 150%.